PART |
Description |
Maker |
FPT-8P-M01 |
SMALL OUTLINE L-LEADED PACKAGE
|
Fujitsu Component Limited. FUJITSU[Fujitsu Media Devices Limited]
|
FPT-28P-M17 |
SMALL OUTLINE L-LEADED PACKAGE 28 PIN PLASTIC
|
Fujitsu Component Limited. FUJITSU[Fujitsu Media Devices Limited]
|
AP2301BGN-HF AP2301BGN-HF-14 |
2.8 A, 20 V, 0.13 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp. Advanced Power Electron...
|
AP2309AGN-HF |
3.4 A, 30 V, 0.075 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp.
|
AP2304AGN-HF |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
|
AP2321GN-HF AP2321GN-HF14 |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
|
AP2306AGEN-HF AP2306AGEN-HF-14 |
Capable of 2.5V Gate Drive, Small Outline Package
|
Advanced Power Electronics Corp. Advanced Power Electronics ...
|
AP2313GN-HF |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
|
AP2338GN-HF |
Capable of 1.8V Gate Drive, Small Outline Package
|
Advanced Power Electronics Corp.
|
AK16D300 |
Shrink Small Outline Package SSOP DIP Adapters
|
ACCUTEK MICROCIRCUIT CO...
|
SOT108-1 |
SO14: plastic small outline package; 14 leads; body width 3.9 mm
|
NXP Semiconductors Philips Semiconductors
|
RQ-16 |
16-Lead Shrink Small Outline Package [QSOP] Dimensions shown in inches
|
Analog Devices
|