| PART |
Description |
Maker |
| M6MGD137W34DKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
| CX-101F CX-101F-24.576MHZ-STBY4-TOL1-CL CX-101F-24 |
QUARTZ CRYSTAL RESONATOR, 32 MHz
SMD
Ultra-thin, thickness 0.75mm. (3.2】2.5】0.75mm)
Ultra-thin/ thickness 0.75mm. (3.22.50.75mm)
Ultra-thin, thickness 0.75mm. (3.2.5.75mm)
Ultra-thin, thickness 0.75mm. (3.22.50.75mm)
QUARTZ CRYSTAL RESONATOR, 24.576 MHz
Ultra-thin, thickness 0.75mm. (3.2×2.5×0.75mm)
|
American KSS
KSS[Kyocera Kinseki Corpotation]
|
| F4294-09 |
MCP ASSEMBLY WITH CENTER HOLE FOR REFLECTRON MS
|
Hamamatsu Photonics
HAMAMATSU[Hamamatsu Corporation]
|
| RMK |
Thin Film Standard Resistive Network, Thin Film Technology, Ultra Film
|
Vishay
|
| AM49DL640BG25IS AM49DL640BG25IT AM49DL640BG35IS |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 堆叠式多芯片封装（MCP）闪存和SRAM
|
Spansion, Inc.
Spansion Inc.
Advanced Micro Devices
|
| S71WS512NB0BAEZZ0 S71WS512NB0BAEZZ2 S71WS512N80BAI |
Stacked Multi-Chip Product (MCP) Flash Memory and pSRAM CMOS 1.8 Volt 堆叠式多芯片产品（MCP）的闪存和移动存储芯片的CMOS 1.8伏特
|
Spansion Inc.
Spansion, Inc.
|
| S71WS-N S71WS512NB0BFWYP3 S71WS512NB0BAWAP3 S71WS5 |
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
|
Spansion Inc.
Spansion, Inc.
|
| AM50DLI28BG AM50DL128BG |
Am50DL128BG - Stacked Multi-Chip Package (MCP) Flash Memory and SRAM Am50DL128BG -堆叠式多芯片封装（MCP）闪存和SRAM
|
Advanced Micro Devices, Inc.
Spansion, Inc.
|
| TP34 TP34J235TR |
0.35 x 3.7 x 3.7 mm Ultra-Low Thin Tactile Switches
|
GREATECS
|
| JL15SKSBP2C JL15SKSCCP2 JL15SKSCP2F JL15SKSDP2C JL |
Ultra-Thin Illuminated Tactile Switches
|
GREATECS
|
| GW12LJPD |
Ultra-Thin Fully Illuminated Paddles
|
List of Unclassifed Manufacturers
|
