| PART |
Description |
Maker |
| F12396-11 |
COMPACT MCP ASSEMBLY SERIES
|
Hamamatsu Corporation
|
| GRS-4013A-1300 |
ASSEMBLY ROCKER SWIDGET S.P.- CENTER OFF
|
CW Industries
|
| SSCDA10008 |
CENTER TAP/DOUBLER ASSEMBLY
|
Sensitron
|
| GRS-4023A-0009 |
ASSEMBLY ROCKER SWIDGET D.P. - CENTER OFF (ON-OFF-ON)
|
CW Industries
|
| GRS-4013A-0008 |
ASSEMBLY ROCKER SWIDGET S.P - CENTER OFF (ON-OFF-ON)
|
CW Industries
|
| GRS-2013A-2000 |
ASSEMBLY DRAWING CENTER OFF S.P.D.T. ROCKER SWITCH NON-POLARIZED 1.125 x .550 PANEL
|
CW Industries
|
| 5390170-6 |
SOCKET ASSEMBLY, 168 POSITION, CENTER PLASTIC POST 2.60[.103] SOLDERTAIL, LOW PROFILE DIMM 2P
|
Tyco Electronics
|
| 0878311821 87831-1821 |
2.00mm (.079) Pitch Milli-Grid Header, Vertical, Through Hole, Shrouded, Lead-free, 18 Circuits, 0.76μm (30μ) Gold (Au) Plating, Center Polarization Slot
2.00mm (.079) Pitch Milli-Grid?/a> Header, Vertical, Through Hole, Shrouded, Lead-free, 18 Circuits, 0.76μm (30μ) Gold (Au) Plating, Center Polarization Slot
2.00mm (.079) Pitch Milli-Grid垄芒 Header, Vertical, Through Hole, Shrouded, Lead-free, 18 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Plating, Center Polarization Slot
|
Molex Electronics Ltd.
|
| S71NS032JA0BJWRT0 S71NS032J80BJWRA |
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA56
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
|
Spansion, Inc.
|
| 87831-2820 |
2.00mm (.079) Pitch Milli-Grid Header, Vertical, Through Hole, Shrouded, Lead-free, 28 Circuits, 0.38μm (15μ) Gold (Au) Plating, Center Polarization Slot
|
Molex Electronics Ltd.
|
|
