| PART |
Description |
Maker |
| ADFC43 |
MULTI-LAYER DIELECTRIC FILTER
|
ABRACON[Abracon Corporation]
|
| ADFC32 |
MULTI-LAYER DIELECTRIC FILTER
|
ABRACON[Abracon Corporation]
|
| ACML-0402-31 ACML-0402-5 ACML-0402-19 ACML-0603-12 |
SURFACE-MOUNT MULTI-LAYER CHIP BEADS 1 FUNCTIONS, 0.3 A, DATA LINE FILTER
SURFACE-MOUNT MULTI-LAYER CHIP BEADS 1 FUNCTIONS, 0.5 A, DATA LINE FILTER
SURFACE-MOUNT MULTI-LAYER CHIP BEADS 1 FUNCTIONS, 0.2 A, DATA LINE FILTER
SURFACE-MOUNT MULTI-LAYER CHIP BEADS 1 FUNCTIONS, 0.15 A, DATA LINE FILTER
SURFACE-MOUNT MULTI-LAYER CHIP BEADS 1 FUNCTIONS, 2.2 A, DATA LINE FILTER
SURFACE-MOUNT MULTI-LAYER CHIP BEADS 1 FUNCTIONS, 1 A, DATA LINE FILTER
SURFACE-MOUNT MULTI-LAYER CHIP BEADS 1 FUNCTIONS, 0.6 A, DATA LINE FILTER
|
Abracon, Corp.
Maxim Integrated Products, Inc.
|
| CE201210-6N8J CE201210-5N6J CE201210-4N7J CE201210 |
IC,MOT,MC68HC908GR8CP, DIP-28, MCU FLASH 8BIT 8MHZ 4K
IC,MCU,MC68HC908JB8ADW,8-BIT SOIC-28,21 I/O,3MHZ
IC,MCU,MC68HC711E9CFN2,8-BIT 2MHz,PLCC52
8-BIT, OTPROM, 2.1 MHz, MICROCONTROLLER, PDIP20
IC,MCU,MC68HC908KX8CDW,8-BIT SOIC-16,13 I/O,8MHZ
Multi-Layer Chip Inductors 1 ELEMENT, 0.12 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0056 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.33 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
IC,MCU,MC68HC705C9ACFN,8-BIT PLCC-44,31 I/O,2MHZ 多层片式电感
Multi-Layer Chip Inductors 1 ELEMENT, 0.39 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Bourns Inc.
Bourns, Inc.
|
| CI201210-6N8J CI201210-5N6D CI201210-4N7D CI201210 |
Multi-Layer Chip Inductors 1 ELEMENT, 0.12 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0047 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.39 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.18 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.018 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Bourns Inc.
Bourns, Inc.
|
| CYV15G0403DXB CYP15G0403DXB-BGC CYV15G0403DXB-BGI |
Physical Layer Devices : Video (SMPTE) PHYs
Physical Layer Devices : Multi-Protocol PHYs
Independent clock quad HOTLink II transceiver. Speed standard.
|
Cypress
|
| 2504026017Y0 |
MULTI-LAYER CHIP BEAD
|
Fair-Rite Products Corp.
|
| BCM5616 |
Integrated Multi Layer Switch
|
Broadcom
|
| CTMCA3216 CTMCA3216-2R4 CTMCA3216-4R9 |
Multi-layer Chip Antennas
|
Central Technologies
|
| CL31A226MQCLNNC |
Multi Layer Ceramic Capacitor
|
Samsung
|
|
