| PART |
Description |
Maker |
| 21-0036 |
PACKAGE OUTLINE, 8L UMAX/USOP
|
Maxim Integrated Products
|
| SC70-6 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
| AP2305GN-HF AP2305GN-HF-14 |
4.2 A, 20 V, 0.053 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| AP2305BGN-HF AP2305BGN-HF-14 |
4.2 A, 20 V, 0.053 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| WLCSP3X4-12 |
Package Outline
|
Global Mixed-mode Techn...
|
| WLCSP2X4-8 |
Package Outline
|
Global Mixed-mode Techn...
|
| TSSOP-16-EP |
Package Outline
|
Global Mixed-mode Techn...
|
| WLCSP2X2-4 |
Package Outline
|
Global Mixed-mode Techn...
|
| TSSOP-28-EP |
Package Outline
|
Global Mixed-mode Techn...
|
| SOT416 |
Package outline
|
NXP Semiconductors
Philips Semiconductors
|
| WDFN2X2-6 |
Package Outline
|
Global Mixed-mode Techn...
|
