| PART |
Description |
Maker |
| MK2761ASTR MK2761A MK2761AS MK2761ASLF MK2761ASLFT |
Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)
|
ICST[Integrated Circuit Systems]
|
| AP2311GN-HF AP2311GN-HF-14 |
1.8 A, 60 V, 0.25 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp. Advanced Power Electronics ...
|
| TO92 |
Through hole, 3 pin package Package outline
|
Zetex Semiconductors
|
| PSB4600-FV1.2 |
PITA (PCI Interface for Telephony/Dat...
|
Infineon
|
| WLCSP5X5-25 |
Package Outline
|
Global Mixed-mode Techn...
|
| SOT23-3 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN3.5X3.5-14 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN5X5-12 |
Package Outline
|
Global Mixed-mode Techn...
|
| TSSOP-38 |
Package Outline
|
Global Mixed-mode Techn...
|
| TSSOP-28-EP |
Package Outline
|
Global Mixed-mode Techn...
|