| PART |
Description |
Maker |
| 408-8737 |
The die assembly consists of an indenter die and nest die. Each die is held in the tool by a single screw
|
Tyco Electronics
|
| 9-0744506-3 C-1-528041-5 |
DIE SET SHIELD CRIMP)HVP800 90DEG. 25 SQMM
|
TE Connectivity Ltd
|
| 0-0519024-2 5-0744010-1 1-0519151-3 1-0519151-1 3- |
ERGOCRIMP-DIE SET ERGOCRIMP MATRIZE
|
Tyco Electronics
|
| 1061149000 |
MPO Swivel EMI Adapter, Simplex, Singlemode or Multimode, Die-Cast, Set Screw
|
Molex Electronics Ltd.
|
| JT6N38S |
TRANSPONDER|CMOS|DIE 转发器|的CMOS |模具
|
TE Connectivity, Ltd.
|
| AM29F100-1 AM29F100B-120DGC AM29F100B-120DGC1 AM29 |
1 megabit CMOS 5.0 volt-only, boot sector flash memory
1 Megabit (128 K x 8-Bit/64 K x 16-Bit) CMOS 5.0 Volt-only/ Boot Sector Flash Memory-Die Revision 1
Hex Inverters 14-VQFN -40 to 85
1兆位28x 8-Bit/64x 16位）.0伏的CMOS只，引导扇区快闪记忆体模修订1
1 Megabit (128 K x 8-Bit/64 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory-Die Revision 1 128K X 8 FLASH 5V PROM, 120 ns, UUC47
1 Megabit (128 K x 8-Bit/64 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory-Die Revision 1 1兆位28亩x 8-Bit/64亩x 16位）.0伏的CMOS只，引导扇区快闪记忆体模修订1
Hex Inverters 14-TSSOP -40 to 85 1兆位28亩x 8-Bit/64亩x 16位）.0伏的CMOS只，引导扇区快闪记忆体模修订1
|
AMD[Advanced Micro Devices]
Advanced Micro Devices, Inc.
PROM
ADVANCED MICRO DEVICES INC
|
| HD44780UA00 |
LCD DISPLAY DRIVER,40-SEG,16-BP,CMOS,DIE
From old datasheet system
|
Hitachi America
|
| SL74HCT74N SL74HCT74 SL74HCT74D |
Dual D Flip-Flop with Set and Reset(High-Performance Silicon-Gate CMOS)
|
SLS[System Logic Semiconductor]
|
| IN74ACT109D |
Dual J-K Flip-Flop with Set and Reset High-Speed Silicon-Gate CMOS
|
IK Semicon Co., Ltd
|
| KK74HCT74AD |
Dual D Flip-Flop with Set and Reset High-Performance Silicon-Gate CMOS
|
KODENSHI KOREA CORP.
|
| KK74AC109 KK74AC109D KK74AC109N |
Dual J-K Flip-Flop with Set and Reset High-Speed Silicon-Gate CMOS
|
KODENSHI KOREA CORP.
|
| KK74ACT74 |
Dual D Flip-Flop with Set and Reset High-Speed Silicon-Gate CMOS
|
KODENSHI KOREA CORP.
|
