| PART |
Description |
Maker |
| MICRF008 MICRF008BM |
QwikRadio?/a> Sweep-Mode Receiver
QwikRadio™ Sweep-Mode Receiver
QwikRadio Sweep-Mode Receiver
QwikRadio⑩ Sweep-Mode Receiver
QwikRadioSweep-Mode Receiver QwikRadio系列⑩扫描模式接收机
|
MICREL[Micrel Semiconductor]
Micrel Semiconductor,Inc.
Micrel Semiconductor, Inc.
|
| 0877056050 87705-6050 |
1.00mm (.039) Pitch DDR-II DIMM 240 Circuits Socket, Vertical, 1.8 Voltage, 2.54mm (.100) Tail Length, Black Latches, Nylon 6/6 Glass-filled, Black Housing
MOLEX Connector
|
Molex Electronics Ltd.
|
| 90816-3216 0908163216 |
1.27mm (.050") Pitch Picoflex庐 SMT Latched Vertical Header, 16 Circuits, Gold (Au) Plating, Black
1.27mm (.050) Pitch Picoflex? SMT Latched Vertical Header, 16 Circuits, Gold (Au) Plating, Black
|
Molex Electronics Ltd.
|
| 0908160324 090816-0324 |
1.27mm (.050) Pitch Picoflex SMT Latched Vertical Header, 24 Circuits, Tin (Sn) Plating, Black
1.27mm (.050") Pitch Picoflex SMT Latched Vertical Header, 24 Circuits, Tin (Sn) Plating, Black
MOLEX Connector
|
Molex Electronics Ltd.
|
| 90130-1218 0901301218 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 18 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 18 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 90130-1212 0901301212 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 12 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 12 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 90130-1208 0901301208 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded 8 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded 8 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 90130-1220 0901301220 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 20 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 20 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 90130-1222 0901301222 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 22 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 22 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 34707-2060 |
Stac64?2 Bay Vertical Headers, 32 Circuits, Bay A 20 Circuit Signal Header, Polarization A, Black; Bay B 12 Circuit Signal Header, Polarization A, Black, Tray
|
Molex Electronics Ltd.
|
| 90816-3304 0908163304 |
1.27mm (.050) Pitch Picoflex SMT Latched Vertical Header, 4 Circuits, Gold (Au) Plating, Black
1.27mm (.050") Pitch Picoflex SMT Latched Vertical Header, 4 Circuits, Gold (Au) Plating, Black
|
Molex Electronics Ltd.
|
|
