| PART |
Description |
Maker |
| LT1ET53A |
3.3X2.9mm, 1.1mm Thickness, Milky Diffusion, Dichromatic Chip LED Devices
|
Sharp Corporation
|
| LT1S73A LT1P73A LT1T73A LT1D73 LT1D73A LT1E73A LT1 |
2.75x1.45mm, 0.9mm Thickness, Compact Milky Diffusion Chip LED Devices
2.7551.45mm, 0.9mm Thickness, Compact Milky Diffusion Chip LED Devices
2.7X51.45mm, 0.9mm Thickness, Compact Milky Diffusion Chip LED Devices
|
List of Unclassifed Manufacturers
ETC[ETC]
N.A.
Electronic Theatre Controls, Inc.
Sharp Corporation
SHARP[Sharp Electrionic Components]
|
| BL-LS3216C0E1 |
3.2mmx1.6mm SMD, 1.1mm THICKNESS
|
BetLux Electronics
|
| AP3216F3C AP32156SF4C |
3.2mm x 1.6mm SMT LED, 1.1mm Thickness
|
KINGBRIGHT[Kingbright Corporation]
|
| AP23VGC-A-F-F01 AP23VGC_A_F-F01 AP23VGC/A/F-F01 |
3x2.4mm SMD CHIP LED LAMP 3x2.4mm贴片发光二极
|
Kingbright Corporation.
Kingbright, Corp.
|
| AP23ZGC_F-F01 AP23ZGC-F-F01 AP23ZGC/F-F01 |
3x2.4mm SMD CHIP LED LAMP 3x2.4mm贴片发光二极
|
Kingbright, Corp.
Kingbright Corporation.
KINGBRIGHT[Kingbright Corporation]
|
| SSC-STW0Q2PA |
Lead Frame type LED PKG size: 5.6*3.0 thickness 0.9mm
|
Seoul Semiconductor
|
| BL-LS3528A0S1IRBB BL-LS3528A0S1IRCB BL-LS3528A0S1I |
3.5mmx2.8mm SMD, 1.9mm THICKNESS PLCC2 package, Infrared LED
|
BetLux Electronics
|
| MSB75DA-1 |
1.9mm x 3.1mm RECTANGULAR BAR LED LAMP
|
MICRO-ELECTRONICS[Micro Electronics]
|
| 52207-1585 |
CONN,FFC,1MM OC,15POSRA(SM CONRA 15P 1MM)
|
Molex
|
| CX-101F CX-101F-24.576MHZ-STBY4-TOL1-CL CX-101F-24 |
QUARTZ CRYSTAL RESONATOR, 32 MHz
SMD
Ultra-thin, thickness 0.75mm. (3.2】2.5】0.75mm)
Ultra-thin/ thickness 0.75mm. (3.22.50.75mm)
Ultra-thin, thickness 0.75mm. (3.2.5.75mm)
Ultra-thin, thickness 0.75mm. (3.22.50.75mm)
QUARTZ CRYSTAL RESONATOR, 24.576 MHz
Ultra-thin, thickness 0.75mm. (3.2×2.5×0.75mm)
|
American KSS
KSS[Kyocera Kinseki Corpotation]
|
| OL6204N-50 OL6204N-50AP OL6204N-50BP OL6204N-BP OL |
From old datasheet system
1.6 um High-Power DIP Module with 9mm Profile
1.6 レm High-Power DIP Module with 9mm Profile
1.6 m High-Power DIP Module with 9mm Profile
1.6 μm High-Power DIP Module with 9mm Profile
Circular Connector; MIL SPEC:MIL-C-26482, Series I, Crimp; Body Material:Aluminum; Series:PT02; No. of Contacts:6; Connector Shell Size:10; Connecting Termination:Crimp; Circular Shell Style:Box Mount Receptacle
|
OKI electronic eomponets
OKI electronic components
OKI[OKI electronic componets]
OKI SEMICONDUCTOR CO., LTD.
|
