| PART |
Description |
Maker |
| 10-89-7321 |
(10-89-7xxx) Dual Row / Straight / Breakaway Header
|
Molex
|
| LSMBC-2-DV |
.079 cl Dual Row - Vertical - Dual Entry Low Profile - Surface Mount Box Contact
|
Major League Electronics
|
| ZP7-10-SS-G ZP7-36-SS-G ZP7-68-SS-G ZP7-20-SS-G ZP |
180隆? SMT - Dual Row Box Header
180° SMT - Dual Row Box Header
|
Yamaichi Electronics Co., Ltd.
|
| 0877612001 87761-2001 |
2.00mm (.079) Pitch Milli-Grid Header, Dual Row Dual Body, Through Hole, Vertical, 20 Circuits, 0.75μm (30μ) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 87939-0001 0879390001 |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row Dual Body, with Plastic Pegs, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 855-99-016-10-001 855-93-016-10-001 855-91-016-10- |
PCB connectors 1.27 mm Single row / double row / triple row Solder tail 电路板连接器1.27毫米单列/双列/三列焊尾
|
PRECI-DIP SA
PREDIP[Precid-Dip Durtal SA]
|
| 70280-0068 A-70280-0068 0010897562 010-89-7562 |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid垄莽 Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38楼矛m (15楼矛") Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| LSA044-161G LSS024-162TT LSS036-162TT LSA042-161G |
44 POS DUAL ROW RIGHT ANGLE ADAPTER TWO PART BOARD CONNECTOR
24 POS DUAL ROW RIGHT ANGLE SOCKET TWO PART BOARD CONNECTOR
36 POS DUAL ROW RIGHT ANGLE SOCKET TWO PART BOARD CONNECTOR
42 POS DUAL ROW RIGHT ANGLE ADAPTER TWO PART BOARD CONNECTOR
|
Advanced Interconnections, Corp.
|
| 87914-2216 0879142216 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| TDB-XX TDB-XX-1 |
DUAL ROW BARRIER BLOCK
|
Adam Technologies, Inc.
|
| LHAD-D-XX-TS-V0 |
DUAL ROW LOCKING HEADER
|
Adam Technologies, Inc.
|
| DPH-2-XX-U-236-236-512 |
DUAL ROW PIN HEADER
|
Adam Technologies, Inc.
|
|
