| PART |
Description |
Maker |
| PI5A4684 PI5A4684GAE |
Chip Scale Packaging, Dual SPDT Analog Switch
|
Pericom Semiconductor Corporation
|
| FAN5350UCX FAN535008 |
3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging
|
Fairchild Semiconductor
|
| 28F1602C3 28F3204C3 29066605 |
3 Volt Advanced Stacked Chip Scale Package Memory
From old datasheet system
|
Intel
|
| AM29841A/BKA AM29841A/B3A AM29843PC AM29843ALC AM2 |
600V Low-Vceon Copack IGBT in a TO-220 FullPak package; Similar to IRGIB7B60KD with Lead Free Packaging
600V UltraFast 10-30 kHz Copack IGBT in a D2-Pak package; A IRGS10B60KD with Standard Packaging
600V UltraFast 10-30 kHz Copack IGBT in a TO-262 package; Similar to IRG4BC15UD-L with Lead Free Packaging
600V UltraFast 10-30 kHz Copack IGBT in a TO-262 package; A IRGSL6B60KD with Standard Packaging
600V UltraFast 10-30 kHz Copack IGBT in a TO-262 package; Similar to IRGSL15B60KD with Lead Free Packaging
1200V UltraFast 4-20 kHz CoPack IGBT in a TO-274AA package; Similar to IRG4PSH71UD with Lead Free Packaging
600V UltraFast 10-30 kHz Copack IGBT in a D2-Pak package; A IRGS6B60KD with Standard Packaging
600V Warp2 150kHz Copack IGBT in a TO-247AC package; A IRGP50B60PD1 with Standard Packaging
600V UltraFast Copack Trench IGBT in a TO-247AD package with Ultra-Low VF Diode for Induction Heating and Soft Switching Apps; A IRGP4068D-EPBF with Standard Packaging
600V HyperFast 1-8 kHz Co-Pack IGBT in a D2-Pak package; A IRG4BC30FD-S with Standard Packaging
600V UltraFast 10-30 kHz Copack IGBT in a TO-262 package; A IRG4BC15UD-L with Standard Packaging
600V Low-Vceon Non Punch Through Copack IGBT in a D2-Pak package; A IRGS4B60KD1 with Standard Packaging
1200V UltraFast 5-40 kHz Copack IGBT in a TO-247AD package; Similar to IRG4PH40UD2-E with Lead Free Packaging 10位D型锁存器
600V UltraFast 8-25 kHz Copack IGBT in a D-Pak package; Similar to IRG4RC10KD with Lead Free Packaging 9位D型锁存器
600V UltraFast 10-30 kHz Copack IGBT in a TO-220AB package; A IRGB6B60KD with Standard Packaging 9位D型锁存器
|
Duracell
TT electronics Semelab, Ltd.
NXP Semiconductors N.V.
|
| 207 208 252 239 250 230 248 256 237 253 242 238 20 |
Low-Frequency Dual EconOscillator
Low-Input-Voltage, 300mA LDO Regulators with RESET in SOT and TDFN
Evaluation Kit for the MAX2251
5 Volt and 3.3 Volt MicroMonitor
Dual, 6-Bit, 400Msps ADC with On-Chip, Wideband Input Amplifier
1-Wire Parasite-Power Digital Thermometer
Econ-Digital Thermometer and Thermostat
3.3V EconoReset with Open Drain Output
Low-Power, 14-Bit Analog-to-Digital Converters with Parallel Interface
Interface IC
Pin Switch Drivers
|
New England Microwave Corp.
|
| CS280 |
Ball Chip Scale Package - CS280
|
XILINX[Xilinx, Inc]
|
| FCSP230LTR |
Chip Scale Package Schottky Barrier Rectifier
|
Vishay Siliconix
|
| FCSP0730TR |
Chip Scale Package Schottky Barrier Rectifier, 0.75 A
|
Vishay Siliconix
|
| SDM0230CSP |
0.2A SCHOTTKY BARRIER DIODE CHIP SCALE PACKAGE
|
Diodes Incorporated
|
| CSPESD303 CSPESD302 CSPESD301 |
"1, 2 and 3-channel ESD Arrays in Chip Scale Package "
|
California Micro Devices
|
