| PART |
Description |
Maker |
| FCSP05H40ETR |
chip scale packaging to deliver Schottky diodes
|
Vishay Siliconix
|
| 28F1602C3 28F3204C3 29066605 |
3 Volt Advanced Stacked Chip Scale Package Memory
From old datasheet system
|
Intel
|
| CM1205-16CS CM1205 CM1205-04CS CM1205-08CS CM1205- |
ESD Protection Arrays, Chip Scale Package ESD保护阵列，芯片级封装
4, 8 and 16-Channel ESD Protection Arrays in Chip Scale Package with OptiGuard™ Coating (PACDN14xxC pin compatible)
|
California Micro Devices Corporation
CALMIRCO[California Micro Devices Corp]
|
| TPS79330YEQT |
ULTRALOW-NOISE, HIGH PSRR, FAST RF 200-mA LOW-DROPOUT LINEAR REGULATORS IN NANOSTAR? WAFER CHIP SCALE AND SOT23
|
TI
|
| LC5852N |
Four-Bit Single-Chip Microcontroller with On-Chip LCD Drivers for Small-Scale Control in Medium-Speed Applications
|
SANYO
|
| AM29F800BT-90WBC AM29F800BT-55WBI AM29F800BB-55WBE |
and flexible way to implement power solutions for the latest high performance CPUs and ASICs.; Same as IR3087 with bag packaging
30V Single N-Channel HEXFET Power MOSFET in a I-Pak package; Similar to IRFU3709Z with Lead Free Packaging
40V Single N-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7470 with Lead Free Packaging
Complete VR11.0 or AMD PVID power solution.; A IR3505M packaged on tape and reel 3000 per reel
8 PWM 400 KHz Sync Contr in a 8-Pin SOIC(NB) package; A IRU3037ACS with Standard Packaging
55V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRLZ44NS with Lead Free Packaging
The XPHASE Control IC combined with an IR XPhase TM Phase IC provides a full featured and flexible way to implement a complete an Opteron or Athlon 64 power solution.; A IR3082M with Tape and Reel Packaging
55V Single N-Channel HEXFET Power MOSFET in a SOT-223 package; Similar to IRLL024Z with Lead Free Packaging
55V Single N-Channel HEXFET Power MOSFET in a SOT-223 package; A IRLL2705 with Standard Packaging
75V Single N-Channel HEXFET Power MOSFET in a TO-262 Package; Similar to IRF2807ZL with Lead Free Packaging
55V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRF3805S with Lead Free Packaging
x8/x16 Flash EEPROM x8/x16闪存EEPROM
XPHASE VRD10 Control IC with VccVid and Overtemp Detect; Similar to IR3080M with Lead Free Packaging on Tape and Reel x8/x16闪存EEPROM
XPHASE IC with Fault and Overtemp Detect; Same as the IR3088AM with Tape and Reel Packaging. x8/x16闪存EEPROM
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 70 ns, PDSO48
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 70 ns, PDSO44
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 150 ns, PDSO48
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 150 ns, PDSO44
|
Linear Technology, Corp.
ATM Electronic, Corp.
Integrated Device Technology, Inc.
Advanced Micro Devices, Inc.
|
| ADG758 ADG759 ADG759BCP ADG758BCP |
3 OHM, 4-/8-CHANNEL MULTIPLEXERS IN CHIP SCALE PACKAGE
|
AD[Analog Devices]
|
| SOC-3000-0001-SP |
Scale-On-Chip ASIC Technical Specification Rev.B1
|
ETC
|
| NP284-26409N NP284-26409P |
Chip Scale Package (CSP, 0.50mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
| 120608 CM1206 L06 CM1206-04CP CM1206-04CS CM1206-0 |
ESD Protection Arrays Chip Scale Package
ESD Protection Arrays, Chip Scale Package
|
CALMIRCO[California Micro Devices Corp]
|
