| PART |
Description |
Maker |
| VL-MM8-1SBN |
1GB 128Mx64 DDR2 SDRAM NON-ECC UNBUFFERED SODIMM 200-PIN
|
List of Unclassifed Manufacturers
|
| HMD4M144D9WG-5 HMD4M144D9WG-6 HMD4M144D9WG |
64Mbyte(4Mx144) 200-pin ECC Mode 4K Ref. DIMM Design 5V
|
Hanbit Electronics Co.,Ltd
|
| SGN02G72F1BQ1SA SGN02G72F1BQ1SA-CCRT SGN02G72F1BQ1 |
204 Pin ECC SO-DIMM
|
Swissbit
|
| M368L6423F M381L3223FTM M381L3223FTM-CLB3A2 M381L6 |
184pin Unbuffered Module based on 256Mb F-die with 64/72-bit Non-ECC / ECC
|
SANKEN[Sanken electric]
|
| MT18JDF1G72PDZ-1G6D1 MT18JDF1G72PDZ-1G1 MT18JDF1G7 |
8GB (x72, ECC, DR) 240-Pin DDR3 VLP RDIMM Features
|
Micron Technology
|
| VL-MM9-2EBN |
2GB 256Mx64 DDR3 SDRAM LOW VOLTAGE NON-ECC UNBUFFERED SODIMM 204-PIN
|
List of Unclassifed Manufacturers
|
| M381L6523BUM-LCC M368L2923BTM-CCC M368L2923BTM-LCC |
DDR SDRAM Unbuffered Module 184pin Unbuffered Module based on 512Mb B-die with 64/72-bit Non ECC/ECC 66 TSOP-II
|
SAMSUNG[Samsung semiconductor]
|
| M374S6553BTS-C7A M366S2953BTS-C7A M366S3354BTS M36 |
SDRAM Unbuffered Module 168pin Unbuffered Module based on 512Mb B-die 62/72-bit Non ECC/ECC
|
SAMSUNG[Samsung semiconductor]
|
| 74062-2513 0740622513 |
2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Header, Vertical, 8-Row,Guide Pin Signal Module, Shield End Version, Pin End Version, 200 Circuits, Pin
|
Molex Electronics Ltd.
|
| 74061-2514 0740612514 |
2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Header, Vertical, 8-Row,Guide Pin Signal Module, Pin End Version, 200 Circuits, Pin Length 5.15mm (.203)
2.00mm (.079") Pitch VHDM垄莽 Board-to-Board Backplane Header, Vertical, 8-Row,Guide Pin Signal Module, Pin End Version, 200 Circuits, Pin Length 5.15mm (.203")
|
Molex Electronics Ltd.
|
