| PART |
Description |
Maker |
| LFBGA-H FBGA |
Fine Pitch Ball Grid Array
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
| SOT926-1 |
plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm
|
NXP Semiconductors
|
| BC-148 |
148-Lead Chip Scale Package Ball Grid Array
|
Analog Devices, Inc.
AD[Analog Devices]
|
| 3-1640240-4 |
Matrix Series Ball Grid Array ( BGA ) Sockets; 2401 POSITION BGA SOCKET ASSEM ( Tyco Electronics )
|
Tyco Electronics
|
| 1-54-712 1-54-724 1-54-716 1-54-732 1-54-708 |
HAMMER BALL PEIN 12OZ
HAMMER BALL PEIN 24OZ
HAMMER BALL PEIN 32OZ
HAMMER BALL PEIN 8OZ
HAMMER BALL PEIN 16OZ 锤球石工16安士
|
ITT, Corp.
|
| EUA2011HIR1 EUA2011JIR1 |
FAN,115VAC,78CFM,120X120X38 DUAL BALL,TERMINAL,UL/CE/CUL 3单声道无滤波器D类音频功率放大器
FAN,220VAC,110CFM,120X120X38 BALL,TERMINAL,UL/CE/TUV/CUL 3单声道无滤波器D类音频功率放大器
FAN,12VDC,9.27CFM,51X51X10,.8W BALL,10.5"LEADS,UL/CUL/TUV/CE
|
Eutech Microelectronics, Inc.
寰蜂俊绉???′唤??????
|
| UPD703108GC-8EU-A |
32-BIT, 40 MHz, RISC MICROCONTROLLER, PQFP100 14 X 14 MM, FINE PITCH, PLASTIC, LQFP-100
|
NEC, Corp.
|
| 5-6123466-0 |
.4mm, .5mm, .6mm, .8mm, Fine Pitch, Surface Mount, Stacking Bd-to-Bd Connectors; ON TAPING (EMBOSS) 0.5MM FS CONN. REC. A ( Tyco Electronics )
|
Tyco Electronics
|
| DF21-20P-0.6SD DF21-20P-0.6SD-GND DF21-20S-0.6V DF |
CAP 0.1UF 100V 80-20% Z5U RAD.20 .20X.20 BULK ROHS-LEAD 0.6毫米间距板对细同轴电缆连接器
0.6mm Pitch Board-to-Fine-Coaxial Cable Connectors 0.6毫米间距板对细同轴电缆连接器
|
HIROSE ELECTRIC Co., Ltd.
Hirose Electric USA, INC.
HIROSE[Hirose Electric]
|
| PD703008YGJ-33-8EU PD70F3008YGJ-33-8EU UPD703008YG |
32 Bit RISC Microcontrollers(32位RISC微控制器)
32-BIT, MROM, 33 MHz, RISC MICROCONTROLLER, PQFP144 20 X 20 MM, FINE PITCH, PLASTIC, QFP-144
|
NEC Corp.
|
| 18107 |
Fine Pitch Bump Adapters
|
Aries Electronics, Inc.
|
| CPGA |
Ceramic Pin Grid Array Package
|
Amkor Technology
|
|
