| PART |
Description |
Maker |
| STW9B12C |
Thermally Enhanced Package Design
|
Seoul Semiconductor
|
| QT301 QT301-D QT301-IS |
0.5-6.0V; 40mA; capacitance to analog converter. For fluid level sensors, prox sensors, moisture detection, position sensing, transducer driver and material sensors
|
Quantum Research Group ltd
ETC
|
| HVR100 |
Small Resin Package (SRP) is suitable for surface mount design
|
TY Semiconductor Co., L...
|
| HVD369B |
Super small Flat Package (SFP) is suitable for surface mount design
|
TY Semiconductor Co., Ltd
|
| HVD372B |
Super small Flat Lead Package (SFP) is suitable for surface mount design
|
TY Semiconductor Co., Ltd
|
| HVD355B |
Super small Flat Lead Package (SFP) is suitable for surface mount design
|
TY Semiconductor Co., Ltd
|
| HSU277 |
Low forward resistance Ultra small Resin Package (URP) is suitable for surface mount design
|
TY Semiconductor Co., L...
|
| SDX010IND4 SDX005IND4 |
Compensated pressure sensors in DIP package
|
List of Unclassifed Manufacturers
ETC[ETC]
|
| SDXL005D4 |
0-5 H2O Compensated Pressure Sensors in a DIP Package
|
Honeywell Accelerometers
|
| AN202-1 AN202 |
Technical Consideration for Migrating CS5460-Based Design to CS5460A-Based Design
From old datasheet system
|
Cirrus Logic
|
| EGF1NCDCDE050 EGF1NOLAT3 EGF1NOACDE050 EGF1NCACDE0 |
CurrentWatch Current Sensors EGF Series Ground Fault Sensors
|
List of Unclassifed Manufacturers
List of Unclassifed Manufac...
List of Unclassifed Man...
|
| UPD65530 UPD65510 UPD65565 UPD65567 UPD65507 |
ANACONDA LT TRANSCEIVER
CMOS Gate Array.Embedded Array Ver.2.0 for Package | Design Manual[05/2003] CMOS门阵列Array.Embedded的包版本2.0 |设计手册[05/2003]
|
TE Connectivity, Ltd.
Vishay Intertechnology, Inc.
|
