| PART |
Description |
Maker |
| MT5LC128K8D4S13A MT5LC64K16D4S13A |
S13A 1 MEG SRAM DIE
|
Micron Technology, Inc.
|
| IDT71T024L200PZI IDT71T024 IDT71T024L150PZ IDT71T0 |
LOW POWER 2V CMOS SRAM 1 MEG (128K x 8-BIT) 128K X 8 STANDARD SRAM, 150 ns, PDSO32
|
Integrated Device Technology, Inc.
IDT[Integrated Device Technology]
|
| MT41J64M16JT MT41J128M8 MT41J256M4 MT41J64M16JT-12 |
DDR3 SDRAM MT41J256M4 ?32 Meg x 4 x 8 banks MT41J128M8 ?16 Meg x 8 x 8 banks MT41J64M16 ?8 Meg x 16 x 8 banks
|
Micron Technology
|
| MT8D132M-XXX MT16D232M-XXX MT16D232-6X MT8D132-7X |
1 MEG, 2 MEG x 32 DRAM MODULES 1乙二醇，二乙二醇× 32 DRAM模块
|
Micron Technology, Inc.
|
| MT41J256M8 MT41J128M16 MT41J128M16HA-15EDTR MT41J1 |
DDR3 SDRAM MT41J512M4 64 Meg x 4 x 8 Banks MT41J256M8 32 Meg x 8 x 8 Banks MT41J128M16 16 Meg x 16 x 8 Banks
2Gb: x4, x8, x16 DDR3 SDRAM Features
DDR3 SDRAM MT41J512M4 ?64 Meg x 4 x 8 Banks MT41J256M8 ?32 Meg x 8 x 8 Banks MT41J128M16 ?16 Meg x 16 x 8 Banks
|
Micron Technology
|
| K7J643682M-FECI30 K7J641882M K7J641882M-FC16 K7J64 |
72Mb M-die DDRII SRAM Specification
|
SAMSUNG[Samsung semiconductor]
|
| K7D321874A-HC37 K7D323674A-HC33 K7D323674A-HC40 K7 |
32Mb A-die DDR SRAM Specification 32兆甲芯片的DDR SRAM的规
|
SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
|
| MT46H16M16LFBF-6ITH MT46H8M32LGB5-75ITA |
Mobile DDR SDRAM MT46H16M16LF ?4 Meg x 16 x 4 banks MT46H8M32LF/LG ?2 Meg x 32 x 4 banks
8M X 32 DDR DRAM, 6 ns, PBGA90
|
Micron Technology
|
| HM065798H-2R HM465798H-2R HM065798H-2RD |
64K X 4 STANDARD SRAM, 25 ns, UUC24 DIE
64K X 4 STANDARD SRAM, 25 ns, CQCC28
|
Atmel, Corp.
|
| IDT71T016 IDT71T016L200PHI IDT71T016L150PH IDT71T0 |
High-Performance Current-Mode PWM Controller 14-SOIC -40 to 85 16K X 4 STANDARD SRAM, 35 ns, CDIP24
LOW POWER 2V CMOS SRAM 1 MEG (64K x 16-BIT) 128K X 8 STANDARD SRAM, 150 ns, PDSO44
CMOS STATIC RAMs 64K (16K x 4-BIT) Added Chip Select and Output Controls 16K X 4 STANDARD SRAM, 25 ns, CDIP24
SWITCH, FLUSH, 16MM, MOM; Switch function type:Mom; Voltage, contact AC max:250V; Temp, op. max:55(degree C); Temp, op. min:-20(degree C); Diameter, panel cut-out:16mm; Depth, external:29.5mm; Configuration, contact:DPCO; Current, RoHS Compliant: Yes
|
Integrated Device Technology, Inc.
IDT[Integrated Device Technology]
Integrated Device Technolog...
|
