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UPD4416004 - 16M-BIT CMOS FAST SRAM 4M-WORD BY 4-BIT

UPD4416004_466381.PDF Datasheet


 Full text search : 16M-BIT CMOS FAST SRAM 4M-WORD BY 4-BIT
 Product Description search : 16M-BIT CMOS FAST SRAM 4M-WORD BY 4-BIT


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UPD4416016G5-A15-9JF UPD4416016G5-A17-9JF UPD44160 1M X 16 STANDARD SRAM, 15 ns, PDSO54
CONNECTOR ACCESSORY
16M-BIT CMOS FAST SRAM 1M-WORD BY 16-BIT
NEC Corp.
NEC[NEC]
M5M4V16169DTP-10 M5M4V16169DTP-7 M5M4V16169DTP-8 M 16MCDRAM:16M(1M-WORD BY 16-BIT) CACHED DRAM WITH 16K (1024-WORD BY 16-BIT) SRAM
MITSUBISHI[Mitsubishi Electric Semiconductor]
UPD444004LLE-A8 UPD444004LLE-A12 UPD444004L UPD444 4M-BIT CMOS FAST SRAM 1M-WORD BY 4-BIT
NEC Corp.
M6MGB_T160S4BVP M6MGB M6MGB160S4BVP M6MGT160S4BVP 16,777,216-BIT (1,048,576 -WORD BY 16-BIT / 2,097,152-WORD BY 8-BIT) CMOS 3.3V-ONLY FLASH MEMORY
16,777,216-BIT CMOS 3.3V-ONLY FLASH MEMORY
CMOS 3.3V-ONLY FLASH MEMORY & CMOS SRAM Stacked-MCP
From old datasheet system
Mitsubishi Electric Corporation
MITSUBISHI[Mitsubishi Electric Semiconductor]
IC66LV10016AL IC66LV10016AL-70B    16M-BIT (1M-WORD BY 16-BIT) Low Power Pseudo SRAM
ASYNCHRONOUS STATIC RAM, Pseudo SRAM
Integrated Circuit Solu...
ICSI[Integrated Circuit Solution Inc]
M5M5V5A36GP-85 M5M5V5A36GP M5M5V5A36GP-75 Memory>Fast SRAM>Network SRAM
18874368-BIT(524288-WORD BY 36-BIT) Flow-Through NETWORK SRAM
RENESAS[Renesas Electronics Corporation]
CF5015 CF5015AL2 CF5015AL1-2 CF5015AL2-2 Low Power SRAM; Organization (word): 1M; Organization (bit): x 16; Memory capacity (bit): 16M; Access time (ns): 55; Supply voltage (V): 2.7 to 3.6; Operating temperature (°C): 0 to 70; Package: FBGA (48)
Low Power SRAM; Organization (word): 1M; Organization (bit): x 16; Memory capacity (bit): 16M; Access time (ns): 85; Supply voltage (V): 2.7 to 3.6; Operating temperature (°C): -40 to 85; Package: FBGA (48)
Low Power SRAM; Organization (word): 1M; Organization (bit): x 16; Memory capacity (bit): 16M; Access time (ns): 70; Supply voltage (V): 2.7 to 3.6; Operating temperature (°C): 0 to 70; Package: FBGA (48)
Low Power SRAM; Organization (word): 1M; Organization (bit): x 16; Memory capacity (bit): 16M; Access time (ns): 85; Supply voltage (V): 2.7 to 3.6; Operating temperature (°C): 0 to 70; Package: FBGA (48)
Low Power SRAM; Organization (word): 1M; Organization (bit): x 16; Memory capacity (bit): 16M; Access time (ns): 70; Supply voltage (V): 2.7 to 3.6; Operating temperature (°C): -40 to 85; Package: FBGA (48)
Low Power SRAM; Organization (word): 1M; Organization (bit): x 16; Memory capacity (bit): 16M; Access time (ns): 85; Supply voltage (V): 2.7 to 3.6; Operating temperature (°C): 0 to 70; Package: FBGA (48)
Low Power SRAM; Organization (word): 1M; Organization (bit): x 16; Memory capacity (bit): 16M; Access time (ns): 70; Supply voltage (V): 2.7 to 3.6; Operating temperature (°C): 0 to 70; Package: FBGA (48)
Low Power SRAM; Organization (word): 1M; Organization (bit): x 16; Memory capacity (bit): 16M; Access time (ns): 70; Supply voltage (V): 2.7 to 3.6; Operating temperature (°C): -40 to 85; Package: FBGA (48)
Seiko NPC Corporation
MC-4516DA726 16M-Word By72-BIT Dynamic RAM Module(16M×72位动态RAM模块)
NEC Corp.
UPD23C16040BLGX UPD23C16040BLGY-MJH UPD23C16040BL 16M-BIT MASK-PROGRAMMABLE ROM 2M-WORD BY 8-BIT (BYTE MODE) / 1M-WORD BY 16-BIT (WORD MODE) PAGE ACCESS MODE
NEC[NEC]
M6MGD137W34DWG 134,217,728-BIT (8,388,608-WORD BY 16-BIT) CMOS FLASH MEMORY & 33,554,432-BIT (2,097,152-WORD BY 16-BIT) CMOS MOBILE RAM
Renesas Electronics Corporation
MR27V12852R MR27V12852L 8M-Word × 16-Bit or 16M-Word × 8-Bit Page mode P2ROM
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