| PART |
Description |
Maker |
| TSSOP48 |
PC board footprint
|
Philips
|
| 74651-1014 0746511014 |
0.80mm (.031) Pitch Ultra VHDCI Wire-to-Board Receptacle, Stacked, Right Anglewith or without Enhanced Shield, Version 4 Footprint, 136 Circuits
|
Molex Electronics Ltd.
|
| 7433-70061 |
0.80mm (.031) Pitch Ultra VHDCI Wire-to-Board Receptacle, Stacked, Right Anglewith or without Enhanced Shield, Version 4 Footprint, 136 Circuits
|
Molex Electronics Ltd.
|
| 74337-0015 |
0.80mm (.031) Pitch Ultra VHDCI Wire-to-Board Receptacle, Stacked, Right Anglewith Enhanced Shield, Version 1 Footprint, 136 Circuits
|
Molex Electronics Ltd.
|
| 74337-0039 |
0.80mm (.031) Pitch Ultra VHDCI Wire-to-Board Receptacle, Stacked, Right Anglewith Enhanced Shield, Version 1 Footprint, 136 Circuits
|
Molex Electronics Ltd.
|
| 74337-0051 0743370051 |
0.80mm (.031) Pitch Ultra VHDCI Wire-to-Board Receptacle, Stacked, Right Anglewith or without Enhanced Shield, Version 4 Footprint, 136 Circuits
|
Molex Electronics Ltd.
|
| 82547GI |
Dual Footprint
|
Intel Corporation
|
| 82547EI |
Dual Footprint
|
Intel Corporation
|
| BXB75-48S12FLTJ BXB75-48S05FLTJ BXB75-48S3V3FLTJ |
Industry standard footprint MTBF >1.4 million hours (Bellcore 332)
Industry standard footprint MTBF >1.4 million hours (Bellcore 332)
|
Emerson Network Power
|
| KP1506W00 |
Small Footprint Surface Mount Package
|
KODENSHI KOREA CORP.
|
| KP3812W00A16 |
Small Footprint Surface Mount Package
|
KODENSHI KOREA CORP.
|
| AP2605GY0-HF-16 |
Small Footprint & Low Profile Package
|
Advanced Power Electron...
|
