| PART |
Description |
Maker |
| 16188 16188-7 |
THERMAL INTERFACE PAD, (MAXI) 热接口垫，（马西
THERMAL INTERFACE PAD (MAXI)
|
Vicor, Corp.
VICOR[Vicor Corporation]
|
| TMP-001 TMP-002 TMP-003 TMP-005 TMP-007 |
TMP Thermal Pad Accessory
|
http://
Crane Aerospace & Electronics.
|
| AND8044D |
Single-Channel 1206A ChipFET TM Power MOSFET Recommended Pad Pattern and Thermal Performance
|
ON Semiconductor
|
| P1BR |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| G751-1P1 G751-2P1 G751-2P8 G75105 G751-2RD |
Digital Temperature Sensor and Thermal Watchdog with Two-Wire Interface
|
Global Mixed-mode Technology Inc.
|
| ZTACV ZTACV-MX-20.000 ZTTCV-MX-20.000 |
2 Pad and 3 Pad Ceramic Package, 3.1 mm x 3.7 mm
|
ILSI America LLC
|
| ZTA-MG ZTA-MT ZTA-MX |
2 Pad and 3 Pad Ceramic Package, 5.5 mm x 10 mm
|
ILSI America LLC
|
| U6803B_05 U6803B U6803B-MFPG3Y U6803B-MFPY U6803B0 |
Triple Driver IC with Thermal Monitoring SPECIALTY INTERFACE CIRCUIT, PDSO8
|
Atmel, Corp.
ATMEL[ATMEL Corporation]
|
| TIC-4000 |
High Performance Thermal Interface Compound for Copper-Based Heat Sinks
|
List of Unclassifed Man...
|
| FF300R12KS4P |
62mm C-Serien Modul mit schnellem IGBT2 für hochfrequentes Schalten und bereits aufgetragenem Thermal Interface Material
|
Infineon Technologies A...
|
| EMC1428 EMC1428-1-AP EMC1428-6-AP |
1∑C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
|
SMSC Corporation
|
