| PART |
Description |
Maker |
| BCM20706UA1KFFB1G |
Embedded Bluetooth 4.2 SoC with MCU, Bluetooth Transceiver, and Baseband Processor
|
Cypress Semiconductor
|
| PH2401 |
Bluetooth RF Transceiver
From old datasheet system
|
Conexant
|
| PT8R1002 |
CMOS Zero-IF Radio Transceiver IC for Bluetooth
|
ETC[ETC]
|
| HMC310MS8GE HMC310MS8G09 |
BLUETOOTH & 2.4 GHz WLAN GaAs MMIC TRANSCEIVER
|
Hittite Microwave Corporation
Hittite Microwave Corpo...
|
| PC13180FC |
2.4 GHz Low Power Wireless Transceiver IC for Bluetooth Applications
|
Motorola, Inc
|
| NE3002-GV10A |
Thermal Printheads > Fro Plastic Card > NE3002-GV Series
|
ROHM
|
| BCM20734 BCM20734UA1KFFB3G |
Single-Chip Bluetooth Transceiver for Wireless Input Devices
|
Cypress Semiconductor
|
| BCM1200-BT BCM1200-BTEM |
Bluetooth® v1.2 Communication Software for Mobile Phones
BLUETOOTH-R V1.2 COMMUNICATIONS SOFTWARE FOR MOBILE PHONES
BLUETOOTH-R V1.2 COMMUNICATIONS SOFTWARE FOR MOBILE PHONES
|
Broadcom Corporation.
BOARDCOM
|
| CGB240 |
2-Stage Bluetooth InGaP HBT Power Amplifier
2.4 to 2.5 GHz HBT Bluetooth Power Amplifier
|
TriQuint Semiconductor,Inc.
TRIQUINT[TriQuint Semiconductor]
|
| NE2004VA10A A5800562 NE2004-VA10A |
Near edge thin film thermal printhead (8 dots / mm)
From old datasheet system
Near edge thin film thermal printhead (8 dot/mm)
Thermal Printheads > Fro Plastic Card > NE200*-, 300*-VA@ Series
|
Rohm CO.,LTD.
ROHM[Rohm]
|
| PARANI-BCD100 |
Bluetooth Module
|
List of Unclassifed Manufacturers
List of Unclassifed Manufac...
|
| BTM41 |
Bluetooth Module
|
BUDDIES TECHNOLOGY LIMI...
|
