| PART |
Description |
Maker |
| SST39SF010A-45-4I-WH SST39SF020A-45-4I-WH SST39SF0 |
64 Mbit (x16) Multi-Purpose Flash Plus 128K X 8 FLASH 5V PROM, 45 ns, PDSO32
64 Mbit (x16) Multi-Purpose Flash Plus 256K X 8 FLASH 5V PROM, 45 ns, PQCC32
64 Mbit (x16) Multi-Purpose Flash Plus 256K X 8 FLASH 5V PROM, 70 ns, PQCC32
64 Mbit (x16) Multi-Purpose Flash Plus 512K X 8 FLASH 5V PROM, 70 ns, PQCC32
64 Mbit (x16) Multi-Purpose Flash Plus 256K X 8 FLASH 5V PROM, 70 ns, PDIP32
64 Mbit (x16) Multi-Purpose Flash Plus 64兆位（x16）的多功能闪存加
|
Silicon Storage Technology, Inc.
PROM
SILICON STORAGE TECHNOLOGY INC
|
| SST39WF1601 SST39WF1601-90-4C-B3QE SST39WF1601-90- |
16 MBIT (X16) MULTI-PURPOSE FLASH PLUS
The SST39WF1601 is a 1M x16 CMOS Multi-Purpose Flash Plus (MPF ) manufactured with SST’s proprietary
|
SST[Silicon Storage Technology, Inc]
Silicon Storage Technology, Inc.
|
| SCN2652 SCN2652AC2N40 SCN68652 SCN68652AC2A44 SCN2 |
Multi-protocol communications controller (MPCC)
HEATSINK TO-220 W/SHURLOCK-CLIP 1 CHANNEL(S), 2M bps, MULTI PROTOCOL CONTROLLER, CDIP40
Multi-protocol communications controller MPCC 1 CHANNEL(S), 2M bps, MULTI PROTOCOL CONTROLLER, PQCC44
Multi-protocol communications controller MPCC 1 CHANNEL(S), 2M bps, MULTI PROTOCOL CONTROLLER, PDIP40
Multi-protocol communications controller MPCC 多协议通信控制器茂
(SCN2652 / SCN68652) Multi-protocol communications controller MPCC
|
NXP Semiconductors N.V.
Philips Semiconductors
|
| CI201210-6N8J CI201210-5N6D CI201210-4N7D CI201210 |
Multi-Layer Chip Inductors 1 ELEMENT, 0.12 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0047 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.39 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.18 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.018 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Bourns Inc.
Bourns, Inc.
|
| CI160808-1N0D CI160808-1N2D CI160808-1N5D CI160808 |
Multi-Layer Chip Inductors 1 ELEMENT, 0.018 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.15 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.18 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0022 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0012 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Bourns Inc.
Bourns, Inc.
|
| GP712 |
IEEE 802.15.4 Multi-Stack Multi-Channel Communications Controller
|
TriQuint Semiconductor
|
| MP2B5038 MP2B5085 MP2B5052 MP2B5150 |
A multi chip power device for a Multi-Oscillated Current Resonant type Converter
|
Fuji Electric
|
| WRT-740DT240B-135 WRT-740DT240B-137 WRT-740DT240B- |
Extended Reach, Client-Side SFP, Multi-Rate,Multi-Protocol, DWDM,3R Transponder
|
JDS Uniphase Corporation
|
| SC2643VXTSTR SC2643VXEVB |
Multi-Platform Multi-Phase PWM Controller 多平台多相位PWM控制
|
Semtech, Corp.
|
| SC2647TSTR SC2647SWTR |
Multi-Platform Multi-Phase PWM Controller
|
Semtech Corporation
|
| SST32HF1621C-70-4C-LFS SST32HF1621C-70-4C-LS SST32 |
Multi-Purpose Flash Plus SRAM ComboMemory SPECIALTY MEMORY CIRCUIT, PBGA63
Multi-Purpose Flash Plus SRAM ComboMemory SPECIALTY MEMORY CIRCUIT, PBGA62
|
Silicon Storage Technology, Inc.
SILICON STORAGE TECHNOLOGY INC
|
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