| PART |
Description |
Maker |
| HYB18L2561 HYE25L256160AC-7.5 HYE25L256160AF-7.5 H |
HEX DIE SET,.052/.068/.100/.21
RT ANG PCB CONT .40/1.295 BULK
BJAWBMSpecialty DRAMs Mobile-RAM BJAWBMSpecialty DRAM的移动RAM
|
http://
INFINEON[Infineon Technologies AG]
|
| HM1-6516_883 HM1-6516B_883 HM4-6516B_883 HM-6516_8 |
DIE SET 50MMSQ
2K x 8 CMOS RAM
|
INTERSIL[Intersil Corporation]
|
| 408-8737 |
The die assembly consists of an indenter die and nest die. Each die is held in the tool by a single screw
|
Tyco Electronics
|
| 9-0744506-3 C-1-528041-5 |
DIE SET SHIELD CRIMP)HVP800 90DEG. 25 SQMM
|
TE Connectivity Ltd
|
| HUF76107D3S HUF76107D3 FN4701 |
From old datasheet system
20A 30V 0.052 Ohm N-Channel Logic Level UltraFET Power MOSFETs
20A, 30V, 0.052 Ohm, N-Channel, Logic Level UltraFET Power MOSFETs
20A/ 30V/ 0.052 Ohm/ N-Channel/ Logic Level UltraFET Power MOSFETs
|
INTERSIL[Intersil Corporation]
|
| 600-052 |
600-052, 600-090, 600-057, 600-083,600-052-1, 600-090-1, 600-057-1 & 600-083-1 Clamping Bands
|
Glenair, Inc.
|
| BCM5226 BCM5226R |
10/100 BASE TX/FX HEX TRANSCEIVER
|
Broadcom Corporation.
|
| AM29BL802C_03 AM29BL802C AM29BL802CB80DGE1 AM29BL8 |
Am29BL802C (Known Good Die Supplement)
8 Megabit (512 K x 16-Bit) CMOS 3.0 Volt-only, Burst-mode, Boot Sector Flash Memory-Die Revision 1
|
Advanced Micro Devices
SPANSION[SPANSION]
|
| LXT9763 |
Fast Ethernet 10/100 Hex Teansceiver with Full MII
|
Level One
|
| HEF4069 HEF4069UB HEF4069UBD HEF4069UBF HEF4069UBN |
HEF4069UB gates; Hex inverter
CERAMIC CHIP/MIL-PRF-55681
Hex inverter; Package: SOT108-1 (SO14) Reel Pack, SMD, 13" 4000/14000/40000 SERIES, HEX 1-INPUT INVERT GATE, PDSO14
Hex inverter; Package: SOT108-1 (SO14); Container: Tube 4000/14000/40000 SERIES, HEX 1-INPUT INVERT GATE, PDSO14
LOGIC GATE|HEX INVERTER|CMOS|SOP|14PIN|PLASTIC
|
NXP Semiconductors N.V.
PHILIPS[Philips Semiconductors]
|
