| PART |
Description |
Maker |
| ROK104022 ROK104001 ROK104021 |
Bluetooth MULTI CHIP MODULE
|
Infineon Technologies A...
Infineon Technologies AG
|
| MC-7884 MC-7884-15 |
GaAs MULTI-CHIP MODULE
|
NEC
Quanzhou Jinmei Electro...
|
| FDMF8700 |
Driver plus FET Multi-chip Module
|
Fairchild Semiconductor
|
| WEDPNF8M722V-1010BC WEDPNF8M722V-1015BC WEDPNF8M72 |
8Mx72 Synchronous DRAM 16Mb Flash Mixed Module Multi-Chip Package
|
WEDC[White Electronic Designs Corporation]
|
| DPS128X16A3-85M DPS128X16H3-85M DPS128X16H3-85B DP |
256K X 8 MULTI DEVICE SRAM MODULE, 85 ns, CPGA50 CERAMIC, MODULE, SLCC, PGA-50
256K X 8 MULTI DEVICE SRAM MODULE, 85 ns, CQFP48 GULLWING, SLCC-48
256K X 8 MULTI DEVICE SRAM MODULE, 85 ns, CQIP48 SLCC-48
|
Twilight Technology, Inc.
|
| FDMF8704 |
High Current / High Frequency FET plus Driver Multi-chip Module
|
Fairchild Semiconductor
|
| MP2B5038 MP2B5085 MP2B5052 MP2B5150 |
A multi chip power device for a Multi-Oscillated Current Resonant type Converter
|
Fuji Electric
|
| SKY77602 |
Multi-Band, Multi-Mode (3G) Power Amplifier Module w/ PA Distribution Switch
|
Skyworks Solutions Inc.
|
| SKY77601 |
Multi-Mode Multi-Band Power Amplifier Module
|
Skyworks Solutions
|
| SYS321000LK-012 SYS321000LK-015 SYS321000ZK-015 SY |
1M X 32 MULTI DEVICE SRAM MODULE, 15 ns, PSMA72 PLASTIC, SIMM-72
1M X 32 MULTI DEVICE SRAM MODULE, 15 ns, PZIP72 PLASTIC, ZIP-72
1M X 32 MULTI DEVICE SRAM MODULE, 20 ns, PSMA72 PLASTIC, SIMM-72
1M X 32 MULTI DEVICE SRAM MODULE, 12 ns, PZIP72 PLASTIC, ZIP-72
x32 SRAM Module X32号的SRAM模块
1M X 32 MULTI DEVICE SRAM MODULE, 20 ns, PZIP72 PLASTIC, ZIP-72
|
Sumida, Corp.
TE Connectivity, Ltd.
|
| TPCF8B01 |
MOSFET TPC Series
TOSHIBA Multi-Chip Device Silicon P Channel MOS Type (U-MOS III) / Schottky Barrier Diode
|
TOSHIBA[Toshiba Semiconductor]
|
