| PART |
Description |
Maker |
| H5MS5162DFR-K3M H5MS5162DFR-E3M H5MS5162DFR-J3M H5 |
512Mb (32Mx16bit) Mobile DDR SDRAM
|
Hynix Semiconductor
|
| K4N51163QC-ZC36 K4N51163QC-ZC K4N51163QC-ZC25 K4N5 |
512Mbit gDDR2 SDRAM
|
SAMSUNG[Samsung semiconductor]
|
| K4S510732B-TC1L K4S510732B-TC1H K4S510732B-TL1L K4 |
Stacked 512Mbit SDRAM 堆积512兆内
|
SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
|
| K4Y50024UC K4Y50024UC-JCA2 K4Y50024UC-JCB3 K4Y5002 |
512Mbit XDR TM DRAM(C-die)
|
Samsung semiconductor
|
| HYB25D512800AT-7F |
512Mbit Double Data Rate SDRAM
|
Infineon Technologies A...
|
| HYB25D512400BC-5 HYB25D512160BC-5 HYB25D512400BT-6 |
512Mbit Double Data Rate (DDR) Components
|
Infineon
|
| M65KG512AB6W9 M65KG512AB M65KG512AB6W8 M65KG512AB8 |
512Mbit (4 banks x 8 Mb x 16) 1.8 V supply, DDR low power SDRAM
|
STMicroelectronics
|
| K4J52324QC K4J52324QC-BJ12 K4J52324QC-BC20 K4J5232 |
512Mbit GDDR3 SDRAM 512MB的GDDR3 SDRAM
|
http://
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
|
| TH58512DC |
A Single 3.3V 512MBit(32M × 8Bit) CMOS NAND EEPROM(单片3.3V 512M32M × 8 CMOS NAND EEPROM)
|
Toshiba Corporation
|
| ST62E30BF1 ST6230BM1/XXX ST62P30BM3/XXX ST62P30BM6 |
MICROCONTROLLER|8-BIT|ST6200 CPU|CMOS|DIP|28PIN|CERAMIC
MICROCONTROLLER|8-BIT|ST6200 CPU|CMOS|SOP|28PIN|PLASTIC
IC, 60FBGA, 512MBIT DDR DRAM 60 PIN BGA 32MBX16
MICROCONTROLLER|8-BIT|ST6200 CPU|CMOS|DIP|28PIN|PLASTIC
IC, MEM, SDRAM DDR166, 32 MEG X 16, 16 BIT, 6NS, 2.5V, FBGA60 单片机| 8位| ST6200的CPU |的CMOS |专科| 28脚|塑料
|
Black Box, Corp.
|
