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LSP1004 - 35 V, SILICON, PIN DIODE ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES 增强性能表面贴装绕流封装器件 ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES

LSP1004_87939.PDF Datasheet

 
Part No. LSP1004 LSP1011 LSP1000 LSP1012 LSP1002 LSP1004-350 LSP1004-150
Description 35 V, SILICON, PIN DIODE
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES 增强性能表面贴装绕流封装器件
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES

File Size 283.78K  /  3 Page  

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MICROSEMI CORP-LOWELL
Microsemi, Corp.
MICROSEMI[Microsemi Corporation]



Homepage http://www.microsemi.com
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 Full text search : 35 V, SILICON, PIN DIODE ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES 增强性能表面贴装绕流封装器件 ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES
 Product Description search : 35 V, SILICON, PIN DIODE ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES 增强性能表面贴装绕流封装器件 ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES


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