| PART |
Description |
Maker |
| V436532S04VATG |
3.3 VOLT 32M x 64 HIGH PERFORMANCE PC133 UNBUFFERED SDRAM MODULE
|
MOSEL[Mosel Vitelic, Corp]
Mosel Vitelic Corp
|
| V827432K24S |
2.5 VOLT 32M x 72 HIGH PERFORMANCE UNBUFFERED ECC DDR SDRAM MODULE
|
MOSEL[Mosel Vitelic, Corp]
|
| V827332N04S |
2.5 VOLT 32M x 72 HIGH PERFORMANCE REGISTERED ECC DDR SDRAM MODULE
|
Mosel Vitelic, Corp.
MOSEL[Mosel Vitelic, Corp]
Mosel Vitelic Corp
|
| V437332S04V V437332S04VXTG-10PC V437332S04VXTG-75 |
3.3 VOLT 32M x 72 HIGH PERFORMANCE UNBUFFERED ECC SDRAM MODULE 3.332M × 72配置高性能无缓冲ECC内存模块
|
Mosel Vitelic, Corp.
Mosel Vitelic Corp
MOSEL[Mosel Vitelic, Corp]
|
| AT45DB321B AT45DB321B-CC AT45DB321B-CI AT45DB321B- |
From old datasheet system
32M bit, 2.7-Volt Only Serial Interface Flash with two 528-Byte SRAM Buffers
32-megabit 2.7-volt Only DataFlash
|
ATMEL[ATMEL Corporation]
|
| IBM13M32734BCD |
32M x 72 2-Bank Registered/Buffered SDRAM Module(32M x 72 2组寄缓冲同步动态RAM模块) 32M × 72配置2，银行注缓冲内存模组2M × 72配置2组寄缓冲同步动态内存模块）
|
IBM Microeletronics
International Business Machines, Corp.
|
| KMM372F3200BK3 |
32M x 72 DRAM DIMM(32M x 72 动RAM模块) 32M × 72配置的DRAM内存2M × 72配置动态内存模块）
|
Samsung Semiconductor Co., Ltd.
|
| IBM11M32735C |
32M x 72 DRAM Module(32M x 72动态RAM模块) 32M × 72配置内存2M × 72配置动态内存模块）
|
International Business Machines, Corp.
|
| V54C3256 V54C3256804VS V54C3256404VS V54C3256404VT |
256Mbit SDRAM 3.3 VOLT, TSOP II / SOC BGA / WBGA PACKAGE 16M X 16, 32M X 8, 64M X 4
256Mbit SDRAM 3.3 VOLT/ TSOP II / SOC BGA / WBGA PACKAGE 16M X 16/ 32M X 8/ 64M X 4
|
Mosel Vitelic, Corp.
Mosel Vitelic Corp
|
| 1760 |
WOODHEAD? TESTERS PERFORM BASIC-VERIFICATION AND MULTIFUNCTION WIRE TESTING WITH COMPACT, SIMPLE-TO-USE DEVICES THAT
|
Molex Electronics Ltd.
|
| KMM372F3200CS1 KMM372F3280CS1 |
32M x 72 DRAM DIMM with ECC using 16Mx4, 4K 8K Refresh, 3.3V 32M × 72配置的DRAM内存的ECC的使6Mx4KK的刷新，3.3
|
Samsung Semiconductor Co., Ltd.
|
