| PART |
Description |
Maker |
| BA01303 |
Triple Band(EGSM900/DCS1800/PCS1900) InGaP HBT Front-end module
|
MITSUBISHI[Mitsubishi Electric Semiconductor]
|
| CXG1047FN |
Dual-Band 3V Power Amplifier for GSM900/DCS1800
|
SONY
|
| RM008 |
PA Module for Dual-band GSM900 and DCS1800 Applications
|
Skyworks Solutions Inc.
|
| RM009 |
Power Amplifier Module for Dual-band GSM900 DCS1800
|
Skyworks Solutions Inc.
|
| PF08103A |
MOS FET Power Amplifier Module for E-GSM900 and DCS1800 Dual Band Handy Phone
|
HITACHI[Hitachi Semiconductor]
|
| MRFIC1817 |
1700-1900 MHz MMIC DCS1800/PCS1900 INTEGRATED POWER AMPLIFIER GaAs MONOLITHIC INTEGRATED CIRCUIT
|
MOTOROLA[Motorola, Inc]
|
| TMXW311 |
SAW Bandpass Filter - PCS1900 Rx - RF
|
TEMEX
|
| MA1100-1 |
For DCS1800 - 30W Power Amplifier 对于DCS1800 30W功率功放
From old datasheet system
|
Mitsubishi Electric, Corp.
MITSUBISHI[Mitsubishi Electric Semiconductor]
|
| BGF944 |
GSM900 EDGE power module
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| CXG1028ATN |
GSM900/1800/1900 SPDT TX/RX Switch
|
SONY
|
| CXG1047FN |
Dual-Band 3V Power Amplifier for GSM900/1800 Applications
From old datasheet system
|
Sony
|
