| PART |
Description |
Maker |
| AP119-89 |
GaAs ic DCS1800/1900 Power Amplifier
|
Skyworks Solutions
|
| CXG1047FN |
Dual-Band 3V Power Amplifier for GSM900/DCS1800 Applications
|
SONY[Sony Corporation]
|
| TIP29C TIP30 TIP30C TIP29 TIP29A TIP29B TIP30A TIP |
POWER TRANSISTORS(1.0A/40-100V/30W) POWER TRANSISTORS(1.0A,40-100V,30W) 功率晶体管(1.0安培,40 - 100V的提0W
|
MOSPEC[Mospec Semiconductor] Mospec Semiconductor, Corp.
|
| PF08103B |
MOS FET Power Amplifier Module for E-GSM900 and DCS1800 Dual Band Handy Phone
|
HITACHI[Hitachi Semiconductor]
|
| PF08127B E2081606PF08127B E2081606_PF08127B |
MOS FET Power Amplifier Module for E-GSM and DCS1800/1900 Triple Band Handy Phone
|
ETC[ETC] RENESAS[Renesas Electronics Corporation]
|
| 5962-05238 5962-05240 5962-05241 5962-05242 5962-0 |
30W Total Output Power 28 Vin 1.5 Vout Single DC-DC Radiation Hardened Converter in a LS Package. DLA Number 5962-05238 30W Total Output Power 28 Vin 5 Vout Single DC-DC Radiation Hardened Converter in a LS Package. DLA Number 5962-05240 30W Total Output Power 28 Vin /-12 Vout Dual DC-DC Radiation Hardened Converter in a LS Package. DLA Number 5962-05241 30W Total Output Power 28 Vin /-15 Vout Dual DC-DC Radiation Hardened Converter in a LS Package. DLA Number 5962-05242 30W Total Output Power 28 Vin 12 Vout Single DC-DC Radiation Hardened Converter in a LS Package. DLA Number 5962-06241 30W Total Output Power 28 Vin 2.5 Vout Single DC-DC Radiation Hardened Converter in a LS Package.
|
International Rectifier
|
| CX77301 |
PA Module for Dual-band EGSM900/DCS1800 and GPRS Applications PA Module Dual-band EGSM900 DCS1800 / GPRS
|
Skyworks Solutions Inc.
|
| TMXW360 |
SAW Bandpass Filter - DCS1800 Rx - RF
|
TEMEX
|
| TMXW313 |
SAW Bandpass Filter - DCS1800 Rx - RF
|
TEMEX
|
| TA8251AH E008170 |
From old datasheet system MAX POWER 30W BTL x 4CH AUDIO POWER IC
|
TOSHIBA[Toshiba Semiconductor]
|
| TA8251AHQ |
MAX POWER 30W BTL X 4CH AUDIO POWER IC
|
Toshiba Semiconductor
|