| |
|
 |
Harwin PLC
HARWIN INC
|
| Part No. |
M52-5102545 M52-5012945
|
| Description |
1.27mm Pitch DIL vertical PC Tail Socket Assembly, 4.6mm height, gold, 25 25-way 50 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER, SOCKET
1.27mm Pitch SIL vertical PC Tail Socket Assembly, 8.5mm height, gold, 29-way
|
| File Size |
1,353.30K /
3 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
0022283302 42225-0100 A-42225-0100 22-28-3302
|
| Description |
2.54mm (.100) Pitch KK? Header, Breakaway, vertical, with Polarizing Wall, 30 Circuits, 0.76μm (30μ) gold (Au) Selective Plating
2.54mm (.100) Pitch KK庐 Header, Breakaway, vertical, with Polarizing Wall, 30 Circuits, 0.76渭m (30渭) gold (Au) Selective Plating
2.54mm (.100) Pitch KK垄莽 Header, Breakaway, vertical, with Polarizing Wall, 30 Circuits, 0.76楼矛m (30楼矛) gold (Au) Selective Plating
|
| File Size |
190.63K /
8 Page |
View
it Online |
Download Datasheet |
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
MMB1901R480 MM-B1901-R480 36512-0196 0365120196
|
| Description |
2.54mm (.100) Pitch DIN 41612 Header, vertical, Through Hole, 0.4μm (16μ) Selective gold (Au), 48 Circuits
2.54mm (.100") Pitch DIN 41612 Header, vertical, Through Hole, 0.4渭m (16渭") Selective gold (Au), 48 Circuits
2.54mm (.100") Pitch DIN 41612 Header, vertical, Through Hole, 0.4楼矛m (16楼矛") Selective gold (Au), 48 Circuits
|
| File Size |
148.52K /
4 Page |
View
it Online |
Download Datasheet |
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
85013-3093 0850133093
|
| Description |
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, vertical, Style R, 1.0μm (39μ)Selective gold (Au), 96 Circuits
2.54mm (.100") Pitch DIN 41612 Header, Through Hole, vertical, Style R, 1.0渭m (39渭")Selective gold (Au), 96 Circuits
2.54mm (.100") Pitch DIN 41612 Header, Through Hole, vertical, Style R, 1.0楼矛m (39楼矛")Selective gold (Au), 96 Circuits
|
| File Size |
146.04K /
5 Page |
View
it Online |
Download Datasheet |
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
85013-3081 0850133081
|
| Description |
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, vertical, Style R, 1.0μm (39μ) Selective gold (Au), 96 Circuits
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, vertical, Style R, 1.0渭m (39渭) Selective gold (Au), 96 Circuits
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, vertical, Style R, 1.0楼矛m (39楼矛) Selective gold (Au), 96 Circuits
|
| File Size |
146.73K /
5 Page |
View
it Online |
Download Datasheet |
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
74029-8050 0740298050
|
| Description |
2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Receptacle Power Module, vertical, 8-Row, 3 Circuits, gold (Au) Selective 1.27μm (50μ)
2.00mm (.079) Pitch VHDM庐 Board-to-Board Backplane Receptacle Power Module, vertical, 8-Row, 3 Circuits, gold (Au) Selective 1.27渭m (50渭)
2.00mm (.079) Pitch VHDM垄莽 Board-to-Board Backplane Receptacle Power Module, vertical, 8-Row, 3 Circuits, gold (Au) Selective 1.27楼矛m (50楼矛)
|
| File Size |
141.91K /
3 Page |
View
it Online |
Download Datasheet |
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
70280-0068 A-70280-0068 0010897562 010-89-7562
|
| Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, vertical, High Temperature, 56 Circuits, 0.38μm (15μ) gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, vertical, High Temperature, 56 Circuits, 0.38渭m (15渭") gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid垄莽 Breakaway Header, Dual Row, vertical, High Temperature, 56 Circuits, 0.38楼矛m (15楼矛") gold (Au) Selective Plating
|
| File Size |
421.87K /
4 Page |
View
it Online |
Download Datasheet |
|
Price and Availability
|
