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For backside Found Datasheets File :: 5931 Search Time::1.484ms
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				Rohm
Part No.	BD63940EFV
OCR Text	...ng conditions. (4) Metal on the backside (Define the side where product markings are printed as front) The metal on the backside is shorted with the backside of IC chip therefore it should be connected to GND. Be aware that there is a possi...
Description	Silicon monolithic integrated circuits
File Size	130.69K / 5 Page	View it Online	Download Datasheet

				MACOM[Tyco Electronics]
Part No.	MA4SPS402
OCR Text	...pedestal and connections to the backside of the device are facilitated by making the pedestal side walls conductive. Selective backside metalization is applied producing a surface mount device. The topside is fully encapsulated with silicon...
Description	Surface Mount Monolithic PIN Diode Chip
File Size	48.88K / 3 Page	View it Online	Download Datasheet

				MACOM[Tyco Electronics]
Part No.	MA4SPS422 MA4SPS42 MA4SPS420
OCR Text	...pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device. This Vertical Topology provides f...
Description	SURMOUNT PIN Diodes
File Size	206.90K / 7 Page	View it Online	Download Datasheet

				MACOM[Tyco Electronics]
Part No.	MA4SPS502_1 MA4SPS5021
OCR Text	...pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls conductive. Selective backside metalization is applied producing a surface mount device. The topside is fully encapsulated with silicon ...
Description	SURMOUNT PIN Diode
File Size	140.90K / 4 Page	View it Online	Download Datasheet


Part No.	MA4SPS42
OCR Text	...destal an d connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. selective backside metallization is applied producing a surface mount device. this vertical topology provide...
Description	MA4SPS42
File Size	209.87K / 7 Page	View it Online	Download Datasheet

				MACOM[Tyco Electronics]
Part No.	MA4SPS502
OCR Text	...pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls conductive. Selective backside metalization is applied producing a surface mount device. The topside is fully encapsulated with silicon ...
Description	Surface Mount Monolithic PIN Diode Chip
File Size	125.84K / 3 Page	View it Online	Download Datasheet

				MACOM[Tyco Electronics]
Part No.	MA4SPS552-W MA4SPS552 MA4SPS552-T
OCR Text	...pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls conductive. Selective backside metalization is applied producing a surface mount device. The topside is fully encapsulated with silicon ...
Description	Surface Mount Monolithic PIN Diode Chip
File Size	151.58K / 6 Page	View it Online	Download Datasheet

For backside Found Datasheets File :: 5931 Search Time::1.484ms
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