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4N403S C5YDL AMF2800S C2012 2002M A063W06 HE311 N4749
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    Q6008LH1LED

Littelfuse
Part No. Q6008LH1LED
OCR Text ...10 0 11 0 12 0 13 0 maximum all owable case temperature (t c ) - c 01234567 8 4 revised: january 25, 2013 08:34 am ?2013 littelfuse, inc specifcations are subject to change without notice. please refer to http://www.littelfuse.com fo...
Description Q6008LH1LED series is designed to meet low load current characteristics typical in LED lighting applications.

File Size 636.57K  /  6 Page

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    FDI030N06

Fairchild Semiconductor
Part No. FDI030N06
OCR Text ...us current based on maximum all owable junction temperature. package limitation cur rent is 120a. fdi030n06 n-channel powertrench ? mosfet fdi030n06 rev. a www.fairchildsemi.com 2 package marking and ordering information electrical ...
Description N-Channel MOSFET

File Size 527.84K  /  8 Page

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    FDB029N06

Fairchild Semiconductor
Part No. FDB029N06
OCR Text ...us current based on maximum all owable junction temperature. package limitation cur rent is 120a. fdb029n06 n-channel powertrench ? mosfet fdb029n06 rev. a www.fairchildsemi.com 2 package marking and ordering information electrical ...
Description N-Channel PowerTrench MOSFET

File Size 538.49K  /  8 Page

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    SA56202 SA56202TW

NXP Semiconductors
Part No. SA56202 SA56202TW
OCR Text ...rmal resistance to heatsink (re?owable die pad). 3. applications n dvd+rw, dvd-rw, dvd-rom and dvd-ram n combi n cd-rom and cd-rw n other compact disk media. sa56202 one-chip motor driver rev. 01 19 july 2004 preliminary data sheet 9397 ...
Description One-chip motor driver

File Size 105.96K  /  24 Page

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    Philips
Part No. SA56203STW/N1
OCR Text ...rmal resistance to heatsink (re?owable die pad) n lead free package. sa56203s one-chip motor driver rev. 01 31 january 2005 preliminary data sheet 9397 750 14192 ? koninklijke philips electronics n.v. 2005. all rights reserved. prelimina...
Description One-chip motor driver

File Size 143.35K  /  30 Page

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    NXP
Part No. SA56203S
OCR Text ...rmal resistance to heatsink (re?owable die pad) n lead free package. sa56203s one-chip motor driver rev. 01 31 january 2005 preliminary data sheet 9397 750 14192 ? koninklijke philips electronics n.v. 2005. all rights reserved. prelimi...
Description One-chip motor driver

File Size 191.56K  /  30 Page

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    30CPF04 30EPF06 30CPF 30CPF02 30CPF06 30EPF 30EPF02 30EPF04

IRF[International Rectifier]
Part No. 30CPF04 30EPF06 30CPF 30CPF02 30CPF06 30EPF 30EPF02 30EPF04
OCR Text ... JEDEC (Modified) Maximum All owable Case Temperature (C) 150 140 130 Conduction Angle 150 140 130 Conduction Period 30EPF.. Series R thJC(DC) = 0.8 K/W 30EPF.. Series R thJC (DC) = 0.8 K/W 120 110 100 90 0 5 10 15 20 25 ...
Description FAST SOFT RECOVERY RECTIFIER DIODE

File Size 139.83K  /  7 Page

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    30EPF06 30CPF06

International Rectifier
Part No. 30EPF06 30CPF06
OCR Text ... JEDEC (Modified) Maximum All owable Case Temperature (C) 150 140 130 Conduction Angle 150 140 130 Conduction Period 30EPF.. Series R thJC(DC) = 0.8 K/W 30EPF.. Series R thJC (DC) = 0.8 K/W 120 110 100 90 0 5 10 15 20 25 ...
Description 200V Fast Recovery Diode in a TO-247AC (2-Pin) package

File Size 146.04K  /  8 Page

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Part No. IR2136
OCR Text ...s - 0.3 v cc + 0.3 dv/dt all owable offset voltage slew rate 50 v/ns p d package power dissipation @ t a +25 c (28 lead pdip) 1.5 (28 lead soic) 1.6 ( 44leadplcc) 2.0 rth ja thermal resistance, junction to ambient (28 l ea...
Description 0.35 A HALF BRDG BASED MOSFET DRIVER, PDIP28

File Size 483.36K  /  36 Page

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