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tfbga160 Datasheet PDF File

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					PHILIPS[Philips Semiconductors]
Part No.	SSTU32865ET SSTU32865 SSTU32865EG SSTU32865ET/G
OCR Text	...5ET Pb-free (SnAgCu solder ball tfbga160 compound) SnPb solder ball compound tfbga160 Description Version plastic thin fine-pitch ball grid array package; SOT802-1 160 balls; body 9 x 13 x 0.8 mm plastic thin fine-pitch ball grid array pack...
Description	1.8 V 28-bit 1:2 registered buffer with parity for DDR2 RDIMM applications
File Size	140.02K / 29 Page	View it Online	Download Datasheet

					NXP Semiconductors N.V.
Part No.	SSTUM32865EG SSTUM32865ES SSTUM32865ET SSTUM32865ETS SSTUM32865
OCR Text	... Pb-free (SnAgCu solder ball tfbga160 plastic thin fine-pitch ball grid array package; SOT802-2 compound) 160 balls; body 9 x 13 x 0.7 mm Pb-free (SnAgCu solder ball tfbga160 plastic thin fine-pitch ball grid array package; SOT802-2 comp...
Description	1.8 V 28-bit 1 : 2 registered buffer with parity for DDR2-800 RDIMM applications
File Size	138.98K / 28 Page	View it Online	Download Datasheet

					NXP Semiconductors
Part No.	SAF7115 SAF7115ET SAF7115HW
OCR Text	...me SAF7115HW SAF7115ET HTQFP100 tfbga160 Description plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad plastic thin fine-pitch ball grid array package; 160 balls Version SOT638-1 SOT1016-1 Type...
Description	Multistandard video decoder with super-adaptive comb filter,
File Size	195.53K / 35 Page	View it Online	Download Datasheet

					NXP Semiconductors
Part No.	SSTUA32S865 SSTUA32S865ET SSTUA32S865ET_G SSTUA32S865ET/G
OCR Text	...T/G Pb-free (SnAgCu solder ball tfbga160 plastic thin fine-pitch ball grid array package; SOT802-1 compound) 160 balls; body 9 x 13 x 0.8 mm SSTUA32S865ET SnPb solder ball compound tfbga160 plastic thin fine-pitch ball grid array package; S...
Description	1.8 V 28-bit 1 : 2 registered buffer with parity for DDR2-667 RDIMM applications
File Size	144.25K / 29 Page	View it Online	Download Datasheet

					NXP Semiconductors
Part No.	SSTUB32865
OCR Text	... Pb-free (SnAgCu solder ball tfbga160 plastic thin fine-pitch ball grid array package; SOT802-2 compound) 160 balls; body 9 x 13 x 0.7 mm Pb-free (SnAgCu solder ball tfbga160 plastic thin fine-pitch ball grid array package; SOT802-2 comp...
Description	1.8 V 28-bit 1 : 2 registered buffer with parity for DDR2-800 RDIMM applications
File Size	146.40K / 28 Page	View it Online	Download Datasheet

					NXP Semiconductors N.V.
Part No.	SSTUG32865 SSTUG32865ET/S518
OCR Text	... Pb-free (SnAgCu solder ball tfbga160 plastic thin fine-pitch ball grid array package; SOT802-2 compound) 160 balls; body 9 x 13 x 0.7 mm Pb-free (SnAgCu solder ball tfbga160 plastic thin fine-pitch ball grid array package; SOT802-2 comp...
Description	1.8 V 28-bit 1 : 2 registered buffer with parity for DDR2-1G RDIMM applications; Package: SOT802-2 (tfbga160); Container: Reel Dry Pack, SMD, 13" SSTU SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PBGA160
File Size	145.54K / 28 Page	View it Online	Download Datasheet

					Philips Semiconductors NXP Semiconductors
Part No.	SSTUH32865 SSTUH32865ET SSTUH32865ET_G SSTUH32865ET/G
OCR Text	...T/G Pb-free (SnAgCu solder ball tfbga160 compound) SSTUH32865ET SnPb solder ball compound tfbga160 Description Version plastic thin fine-pitch ball grid array package; SOT802-1 160 balls; body 9 x 13 x 0.8 mm plastic thin fine-pitch ball gr...
Description	1.8V 28-bit high output drive 1:2 registered buffer 1.8 V 28-bit high output drive 1:2 registered buffer with parity for DDR2 RDIMM applications
File Size	136.13K / 28 Page	View it Online	Download Datasheet

					NXP Semiconductors Philips Semiconductors
Part No.	SSTU32865EG SSTU32865ET SSTU32865
OCR Text	...5ET Pb-free (SnAgCu solder ball tfbga160 compound) SnPb solder ball compound tfbga160 Description Version plastic thin fine-pitch ball grid array package; SOT802-1 160 balls; body 9 x 13 x 0.8 mm plastic thin fine-pitch ball grid array pack...
Description	1.8 V 28-bit 1:2 registered buffer with parity for DDR2 RDIMM Linear Voltage Regulator IC; Package/Case:8-MSOP; Current Rating:250mA; Leaded Process Compatible:No; Output Voltage Max:1.5V; Peak Reflow Compatible (260 C):No; Reel Quantity:2500; Voltage Regulator Type:Low Dropout (LDO) Linear Voltage Regulator IC; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No
File Size	145.78K / 29 Page	View it Online	Download Datasheet

					Philips Semiconductors
Part No.	SSTUM32865
OCR Text	...e (snagcu solder ball compound) tfbga160 plastic thin ?ne-pitch ball grid array package; 160 balls; body 9 13 0.7 mm sot802-2 sstum32865et/s pb-free (snagcu solder ball compound) tfbga160 plastic thin ?ne-pitch ball grid array package; 16...
Description	1.8 V 28-bit 1 : 2 registered buffer
File Size	199.42K / 28 Page	View it Online	Download Datasheet

					NXP Semiconductors N.V.
Part No.	SAF7115HW SAF7115-15
OCR Text	...osed die pad sot638-1 saf7115et tfbga160 plastic thin ?ne-pitch ball grid array package; 160 balls sot1016-1 xxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx x xxxxxxxxxxxxxx xxxxxxxxxx xxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxx x...
Description	Multistandard video decoder with super-adaptive comb filter, scaler and VBI data read-back via I2C-bus COLOR SIGNAL DECODER, PQFP100
File Size	202.44K / 35 Page	View it Online	Download Datasheet

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