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  TES1-0513 Datasheet PDF File

For TES1-0513 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |   

    51353-3000 0513533000

Molex Electronics Ltd.
Part No. 51353-3000 0513533000
Description 2.00mm (.079) Pitch MicroClasp?/a> Wire-to-Board Receptacle Housing, Positive Lock Dual Row, 30 circuits

File Size 242.32K  /  3 Page

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Amphenol Communications Solutions

Part No. 68405-130HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0436500513

Molex Electronics Ltd.
Part No. 0436500513
Description
File Size 152.53K  /  3 Page

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Amphenol Communications Solutions

Part No. 68705-131HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 31 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0513820600 51382-0600

Molex Electronics Ltd.
Part No. 0513820600 51382-0600
Description 2.00mm (.079) Pitch MicroClasp Wire-to-Board Receptacle Housing, Positive Lock, Single Row, 6 circuits

File Size 141.12K  /  3 Page

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Amphenol Communications Solutions

Part No. U95Z2454051301
Description ULTQSFP 2X2 COMBO 4LP&SPFG
Tech specs    

Official Product Page

    51353-2400 0513532400

Molex Electronics Ltd.
Part No. 51353-2400 0513532400
Description 2.00mm (.079) Pitch MicroClasp Wire-to-Board Receptacle Housing, Positive LockDual Row, 24 circuits

File Size 242.32K  /  3 Page

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Amphenol Communications Solutions

Part No. 98426-G04-05-133LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 10 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    51382-0200 0513820200

Molex Electronics Ltd.
Part No. 51382-0200 0513820200
Description 2.00mm (.079) Pitch MicroClasp?/a> Wire-to-Board Receptacle Housing, Positive LockSingle Row, 2 circuits
2.00mm (.079) Pitch MicroClasp Wire-to-Board Receptacle Housing, Positive LockSingle Row, 2 circuits

File Size 141.11K  /  3 Page

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Amphenol Communications Solutions

Part No. 73305-131LF
Description RJ45 Modular Jack, Input Output Connectors, CAT 3, Standard, 6P6C, Right Angle, Surface Mount, without Shield, 1 Port.
Tech specs    

Official Product Page

    51353-2200 0513532200

Molex Electronics Ltd.
Part No. 51353-2200 0513532200
Description 2.00mm (.079) Pitch MicroClasp Wire-to-Board Receptacle Housing, Positive LockDual Row, 22 circuits

File Size 242.32K  /  3 Page

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Amphenol Communications Solutions

Part No. 68705-130HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    51353-2000 0513532000

Molex Electronics Ltd.
Part No. 51353-2000 0513532000
Description 2.00mm (.079) Pitch MicroClasp Wire-to-Board Receptacle Housing, Positive Lock Dual Row, 20 circuits

File Size 242.35K  /  3 Page

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Amphenol Communications Solutions

Part No. 54121-407051300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    51336-1710 0513361710

Molex Electronics Ltd.
Part No. 51336-1710 0513361710
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 17Circuits
1.25mm (.049) Pitch Mini Mi II?/a> System Wire-to-Board IDT Housing, Single Row, 17Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 17Circuits

File Size 99.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 10120513-002C-TRLF
Description SAS/PCIe 3.0 (U.2) Connectors, Storage and Server Connector, 68 Position Vertical Recep SMT, 12Gb/s.
Tech specs    

Official Product Page

    51336-1510 0513361510

Molex Electronics Ltd.
Part No. 51336-1510 0513361510
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 15Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 15Circuits

File Size 99.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 54102-S0513B03LF
Description BERGSTIK 0.100\\ HEADER-REPLACMNT 77313-801-26LF
Tech specs    

Official Product Page

    51336-1210 0513361210

Molex Electronics Ltd.
Part No. 51336-1210 0513361210
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 12Circuits
1.25mm (.049) Pitch Mini Mi II?/a> System Wire-to-Board IDT Housing, Single Row, 12Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 12Circuits

File Size 99.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 54112-807051300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 5 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For TES1-0513 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |   

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