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  reflow Datasheet PDF File

For reflow Found Datasheets File :: 44791    Search Time::1.593ms    
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    TriQuint Semiconductor, Inc.
Part No. TGA2925-SG-T/R
OCR Text ...chment. Follow solder paste and reflow oven vendors' recommendations when developing a solder reflow profile. Typical solder reflow profiles are listed in the table below. Hand soldering is not recommended. Solder paste can be applied using...
Description
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    TriQuint Semiconductor,Inc.
Part No. TGA2925-SG
OCR Text ...chment. Follow solder paste and reflow oven vendors' recommendations when developing a solder reflow profile. Typical solder reflow profiles are listed in the table below. Hand soldering is not recommended. Solder paste can be applied using...
Description 5.6 Watt 3.5GHz Packaged HPA

File Size 269.24K  /  10 Page

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    LRGB9553-R1-1-TR1

LIGITEK electronics co., ltd.
Part No. LRGB9553-R1-1-TR1
OCR Text ... 120 ~ 150 120 ~ 180 sec reflow Temp/Time Temp. () 220 Rising +5/sec Cooling -5/sec 150 120 Preheat 60 ~ 120 sec 5sec Time LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LRGB9553/R1-1/TR1 Precaut...
Description SURFACE MOUNT LED TAPE AND REEL

File Size 166.08K  /  10 Page

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    Mimix Broadband, Inc.
Part No. XD1005-QT-EV1 XD1005-QT-0G00 MIMIXBROADBANDINC.-XD1005-QT-EV1
OCR Text ...oduct due to thermal stress. reflow Profile Ramp Up Rate Activation Time and Temperature Time Above Melting Point Max Peak Temperature Time Within 5 C of Peak Ramp Down Rate SnPb 3-4 C/sec 60-120 sec @ 140-160 C 60-150 sec 240 C 10-20...
Description 10.0-40.0 GHz GaAs MMIC Distributed Amplifier, QFN 10000 MHz - 40000 MHz RF/MICROWAVE WIDE BAND HIGH POWER AMPLIFIER
10.0-40.0 GHz GaAs MMIC Distributed Amplifier, QFN 10.0-40.0千兆赫的GaAs MMIC分布式放大器QFN封装

File Size 194.27K  /  5 Page

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    UPC339C UPC339G2 UPC339 C339C

NEC Corp.
NEC[NEC]
Part No. UPC339C UPC339G2 UPC339 C339C
OCR Text ...(225 mil) Process Infrared ray reflow Conditions Peak temperature: 230 C or below (Package surface temperature), reflow time: 30 seconds or less (at 210 C or higher), Maximum number of reflow processes: 1 time. Peak temperature: 215 C or b...
Description LOW POWER QUAD COMPARATOR

File Size 59.67K  /  12 Page

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    74AHCT1G00 74AHCT1G00GW 74AHC1G00 74AHC1G00GW

Philips Semiconductors
Part No. 74AHCT1G00 74AHCT1G00GW 74AHC1G00 74AHC1G00GW
OCR Text ... densities. In these situations reflow soldering is often used. reflow soldering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen pri...
Description 2-input NAND gate

File Size 80.05K  /  12 Page

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    74AHCT1G02 74AHCT1G02GW 74AHC1G02 74AHC1G02GW

Philips Semiconductors
Part No. 74AHCT1G02 74AHCT1G02GW 74AHC1G02 74AHC1G02GW
OCR Text ... densities. In these situations reflow soldering is often used. reflow soldering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen pri...
Description 2-input NOR gate

File Size 80.65K  /  12 Page

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    74AHCT1G04 74AHCT1G04GW 74AHC1G04 74AHC1G04GW

Philips Semiconductors
Part No. 74AHCT1G04 74AHCT1G04GW 74AHC1G04 74AHC1G04GW
OCR Text ... densities. In these situations reflow soldering is often used. reflow soldering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen pri...
Description Inverter

File Size 79.87K  /  12 Page

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    74AHCT1G08 74AHCT1G08GW 74AHC1G08 74AHC1G08GW

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. 74AHCT1G08 74AHCT1G08GW 74AHC1G08 74AHC1G08GW
OCR Text ... densities. In these situations reflow soldering is often used. reflow soldering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen pri...
Description 2-input AND gate

File Size 80.01K  /  12 Page

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    74AHCT1G32 74AHCT1G32GW 74AHC1G32 74AHC1G32GW 74AHC1G32GW/T1

NXP Semiconductors N.V.
PHILIPS[Philips Semiconductors]
Part No. 74AHCT1G32 74AHCT1G32GW 74AHC1G32 74AHC1G32GW 74AHC1G32GW/T1
OCR Text ... densities. In these situations reflow soldering is often used. reflow soldering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen pri...
Description IC-SM-CMOS LOGIC
2-input OR gate

File Size 80.51K  /  12 Page

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