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  BC337-1611 Datasheet PDF File

For BC337-1611 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |   

    HBCR-1611 HBCR-1610 HBCR-1612 HBCR-1697

Agilent(Hewlett-Packard...
HP[Agilent(Hewlett-Packard)]
Agilent (Hewlett-Packard)
Part No. HBCR-1611 HBCR-1610 HBCR-1612 HBCR-1697
Description Single Chip Bar Code Decode IC

File Size 189.41K  /  10 Page

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Amphenol Communications Solutions

Part No. 131-6116-11H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Sanyo
Part No. LA6516 1611
Description Monolithic Linear IC
From old datasheet system

File Size 104.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-6116-11D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    RN1611 RN1610

TOSHIBA[Toshiba Semiconductor]
Part No. RN1611 RN1610
Description TOSHIBA Transistor Silicon Npn Epitaxial Type (PCT Process)

File Size 165.83K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021611-00012T1LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 12 contacts
Tech specs    

Official Product Page

    W91610 W91611

Winbond Electronics Corp
Part No. W91610 W91611
Description TONE/PULSE DIALER WITH TWO-STAGE REDIAL FUNCTION

File Size 160.05K  /  12 Page

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Amphenol Communications Solutions

Part No. 20021611-00030T1LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 30 contacts
Tech specs    

Official Product Page

    Shenzhen Jin Yu Semiconductor Co., Ltd.
Part No. 2SA1611
Description TRANSISTOR(PNP)

File Size 273.97K  /  1 Page

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Amphenol Communications Solutions

Part No. 87916-113HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 13 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail.
Tech specs    

Official Product Page

    Microsemi
Part No. LXM1611-01
Description CCFL Inverter Module - Single Lamp

File Size 159.33K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021611-00040T8LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 40 contacts
Tech specs    

Official Product Page

   
Part No. 23L1611
Description From old datasheet system

File Size 57.01K  /  7 Page

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Amphenol Communications Solutions

Part No. 87916-111HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 11 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail.
Tech specs    

Official Product Page

    2SA1611

Guangdong Kexin Industrial Co.,Ltd
Part No. 2SA1611
Description PNP Silicon Epitaxia

File Size 43.92K  /  1 Page

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Amphenol Communications Solutions

Part No. 20021611-00008T1LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 8 contacts
Tech specs    

Official Product Page

    2SA1611

SeCoS Halbleitertechnologie GmbH
Part No. 2SA1611
Description PNP Silicon Plastic Encapsulated Transistor

File Size 105.89K  /  1 Page

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Amphenol Communications Solutions

Part No. U90H161100A
Description ExpressPort QSFP+, High Speed Input Output Connectors, QSFP 12.73MM HS 1X1.
Tech specs    

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    2SD1611

Guangdong Kexin Industrial Co.,Ltd
Part No. 2SD1611
Description Silicon NPN Triple Diffusion Planar Type Darlington

File Size 39.63K  /  2 Page

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Amphenol Communications Solutions

Part No. 131-3516-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

For BC337-1611 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |   

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