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				Freescale Semiconductor, Inc
Part No.	MMA5124KW MMA5106KW MMA5124KWR2 MMA5112KWR2 MMA5148KW MMA51XXKW MMA5106KWR2 MMA5148KWR2
OCR Text	...he analog circuitry. 17 pad die attach pad this pin is the die attach flag, and is internally connected to vss. reference section 6 for die attach pad connection details. corner pads corner pads the corner pads are internally connected ...
Description	PSI5 Inertial Sensor
File Size	1,007.50K / 55 Page	View it Online	Download Datasheet

				Maxim Integrated Produc... MAXIM - Dallas Semiconductor MAXIM[Maxim Integrated Products] Maxim Integrated Products, Inc.
Part No.	32TSOP
OCR Text	...nd: Lead Frame: Lead Finsh: Die attach: Bond Wire / Size: Flammability: Theta JA: Theta JC: Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: PACKAGE TESTS DESCRIPTION SOLDERABILITY DATE CODE CONDITION 0429 JESD22-B102 Total: READPOI...
Description	PACKAGE RELIABILITY REPORT
File Size	32.75K / 11 Page	View it Online	Download Datasheet

				Omron Electronics LLC
Part No.	B3D10
OCR Text	...arrays ? no soldering required. attach directly to pcb to make an ultra-low profile tactile switch. construction provides strong resistance to static electricity by having no soldered terminals. ? matrix adhesive used to create highly du...
Description	Ultra-low Profile Dome Key
File Size	214.31K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC56409
OCR Text	...ne way to accomplish this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (figure 2). microstrip substrates should be brought as close to...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 7 - 13.5 GHz
File Size	234.69K / 6 Page	View it Online	Download Datasheet

				TriQuint Semiconductor
Part No.	TGC4702-FC TGC4702-FC-15
OCR Text	...ars component placement and die attach assembly notes: ? vacuum pencils and/or vacuum collets are the prefe rred method of pick up. ? air bridges must be avoided during placement. ? cu pillars on die are 65 um tall with a 22 um tall sn sold...
Description	77 GHz Down Converting IQ Mixer
File Size	235.18K / 13 Page	View it Online	Download Datasheet

				Transcom, Inc.
Part No.	TC1606
OCR Text	...patible with standard ausn die-attach. typical application include commercial and military high performance power amplifiers electrical specifications (t a =25 c) symbol conditions min typ max unit p 1db output power at 1db gain...
Description	2W High Linearity and High Efficiency GaAs Power FETs
File Size	145.64K / 4 Page	View it Online	Download Datasheet

				Transcom, Inc.
Part No.	TC1606N
OCR Text	...mpatible with standard ausn die-attach. typical application include commercial and military high performance power amplifier. electrical specifications (t a =25 c) symbol conditions min typ max unit p 1db output power at 1db gai...
Description	2W High Linearity and High Efficiency GaAs Power FETs
File Size	63.03K / 2 Page	View it Online	Download Datasheet

				Intel Corporation
Part No.	E10G42AFDA
OCR Text	... server adapter provides direct attach copper twinaxial cable connections between servers and a top-of-rack switch. two ports, coupled with a low-profile pci express* form factor, make this adapter ideal for slot-constrained environments...
Description	Intel? 10 Gigabit AF DA Dual Port Server Adapter
File Size	745.93K / 4 Page	View it Online	Download Datasheet

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