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  90143-0120 Datasheet PDF File

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    15020-0120

Molex Electronics Ltd.
Part No. 15020-0120
Description 0.50mm Pitch Premo-Flex FFC Jumper, Opposite Side Contacts (Type D),

File Size 34.67K  /  1 Page

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Rochester Electronics LLC

Part No. 27C010-120DI
Description 27C010 - 1024K (128K x 8) CMOS EPROM
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    90120-0935

Molex Electronics Ltd.
Part No. 90120-0935
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, 15 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,066.59K  /  9 Page

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Amphenol Communications Solutions

Part No. 87901-434HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 34 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    90120-0956

Molex Electronics Ltd.
Part No. 90120-0956
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, 36 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 133.01K  /  3 Page

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Amphenol Communications Solutions

Part No. 87901-438HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 38 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    90120-0925

Molex Electronics Ltd.
Part No. 90120-0925
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, 5 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,066.59K  /  9 Page

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Amphenol Communications Solutions

Part No. 87901-430
Description BERGSTIK II .100CC DR-STRAIGHT
Tech specs    

Official Product Page

    70567-0120

Molex Electronics Ltd.
Part No. 70567-0120
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 40 Circuits, Tin (Sn) Plating

File Size 1,211.71K  /  7 Page

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Amphenol Communications Solutions

Part No. 87901-432HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 32 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    90120-0770

Molex Electronics Ltd.
Part No. 90120-0770
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 1,066.59K  /  9 Page

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Amphenol Communications Solutions

Part No. 87901-436HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 36 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    90120-0764

Molex Electronics Ltd.
Part No. 90120-0764
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, 4 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 1,066.59K  /  9 Page

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Amphenol Communications Solutions

Part No. GSD090143HR
Description Sd Card Connector, Push-push Type, 9 Position.
Tech specs    

Official Product Page

    90120-0765

Molex Electronics Ltd.
Part No. 90120-0765
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, 5 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 1,066.58K  /  9 Page

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Amphenol Communications Solutions

Part No. 10120818-001CLF
Description SAS 3.0 Connectors, Storage & Server System, Receptacle, Vertical, Surface Mount, 29 Positions, 12Gb/s.
Tech specs    

Official Product Page

    90120-0766

Molex Electronics Ltd.
Part No. 90120-0766
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 1,066.59K  /  9 Page

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Amphenol Communications Solutions

Part No. 76350-120-22LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Double row , 22 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    90120-0767

Molex Electronics Ltd.
Part No. 90120-0767
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, 7 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 1,066.59K  /  9 Page

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Amphenol Communications Solutions

Part No. 93690-101-20LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Press Fit, Double Row, 20 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

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