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    M20-7822046 M20-7823842 M20-7830246 M20-7831042 M20-7821942 M20-7822042 M20-7821146 M20-7823546 M20-7822542 M20-7821542

Harwin PLC
HARWIN INC
Part No. M20-7822046 M20-7823842 M20-7830246 M20-7831042 M20-7821942 M20-7822042 M20-7821146 M20-7823546 M20-7822542 M20-7821542 M20-7822246 M20-7821342 M20-7821042 M20-7823146 M20-7822242 M20-7830746 M20-7824042
Description 2.54mm Pitch SIL Vertical PC Tail Socket Assembly, tin, 20-way 20 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER, SOCKET
2.54mm Pitch SIL Vertical PC Tail Socket Assembly, selective gold tin, 38-way 38 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER, SOCKET
2.54mm Pitch DIL Vertical PC Tail Socket Assembly, tin, 2 2-way 4 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER, SOCKET
2.54mm Pitch DIL Vertical PC Tail Socket Assembly, selective gold tin, 10 10-way 20 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER, SOCKET
2.54mm Pitch SIL Vertical PC Tail Socket Assembly, selective gold tin, 19-way 19 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER, SOCKET
2.54mm Pitch SIL Vertical PC Tail Socket Assembly, selective gold tin, 20-way 20 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER, SOCKET
2.54mm Pitch SIL Vertical PC Tail Socket Assembly, tin, 11-way 11 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER, SOCKET
2.54mm Pitch SIL Vertical PC Tail Socket Assembly, tin, 35-way 35 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER, SOCKET
2.54mm Pitch SIL Vertical PC Tail Socket Assembly, selective gold tin, 25-way 25 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER, SOCKET
2.54mm Pitch SIL Vertical PC Tail Socket Assembly, selective gold tin, 15-way 15 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER, SOCKET
2.54mm Pitch SIL Vertical PC Tail Socket Assembly, tin, 22-way 22 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER, SOCKET
2.54mm Pitch SIL Vertical PC Tail Socket Assembly, selective gold tin, 13-way 13 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER, SOCKET
2.54mm Pitch SIL Vertical PC Tail Socket Assembly, selective gold tin, 10-way 10 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER, SOCKET
2.54mm Pitch SIL Vertical PC Tail Socket Assembly, tin, 31-way 31 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER, SOCKET
2.54mm Pitch SIL Vertical PC Tail Socket Assembly, selective gold tin, 22-way 22 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER, SOCKET
2.54mm Pitch DIL Vertical PC Tail Socket Assembly, tin, 7 7-way 14 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER, SOCKET
2.54mm Pitch SIL Vertical PC Tail Socket Assembly, selective gold tin, 40-way
File Size 799.49K  /  1 Page

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Amphenol Communications Solutions
Part No. 65823-508
Description Quickie Header, Wire to Board Connector, Double Row, 30 Positions, 2.54 mm (0.1 in.), Right Angle Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    PV1823500KL PV1823100ML PV1823501KL PV1823251KL PV1823250KL PV1823101KL PV1823102KL

ABC Taiwan Electronics Corp
Part No. PV1823500KL PV1823100ML PV1823501KL PV1823251KL PV1823250KL PV1823101KL PV1823102KL
Description POWER INDUCTOR
File Size 94.04K  /  3 Page

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Amphenol Communications Solutions
Part No. RJE1R288235471
Description Modular Jacks, Input Output Connectors, 8P8C, Cat5e over Cat6, Stacked, Shield, With LEDs
Tech specs 　 　

Official Product Page

    RCB1823500KZF RCB1823501KZF RCB1823250KZF RCB1823101KZF RCB1823102KZF RCB1823251KZF RCB1823100MZF RCB1823

Superworld Electronics
Part No. RCB1823500KZF RCB1823501KZF RCB1823250KZF RCB1823101KZF RCB1823102KZF RCB1823251KZF RCB1823100MZF RCB1823
Description    RADIAL CHOKE COIL
File Size 589.13K  /  4 Page

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Amphenol Communications Solutions
Part No. RJE1R2882354H1
Description Modular Jacks, Input Output Connectors, 8P8C, Cat5e over Cat6, Stacked, Shield, With LEDs
Tech specs 　 　

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    Cornell Dubilier Electr...
Part No. P10G6815-F P10R4711-F P10R4721-F P10R4735-F P40G1035-F P20R6835-F P20R1531-F P20R3331-F P20R5635-F P20R8235-F P20R1831-F P20R1045-F P20R2731-F P30G6825-F P30G6821-F P10R1835-F P30U6831-F P10U6835-F P30U5631-F P30G8225-F P30G8221-F P40R3945-F P30U3945-F P10G3301-F P10G1801-F
Description    Conformally coated, axial leaded
File Size 180.11K  /  4 Page

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Amphenol Communications Solutions
Part No. RJE1R288235423
Description Modular Jacks, Input Output Connectors, 8P8C, Cat5e over Cat6, Stacked, Shield, With LEDs
Tech specs 　 　

Official Product Page

    P10G5601-F P10G1001-F P10G3301-F P10G2201-F P10G1801-F P40R4745-F P10G5602-F P10R8221-F P10R3921-F P12G1825-F P20G1825-F

Cornell Dubilier Electronics
Cornell Dubilier Electronic...
Cornell Dubilier Electr...
Part No. P10G5601-F P10G1001-F P10G3301-F P10G2201-F P10G1801-F P40R4745-F P10G5602-F P10R8221-F P10R3921-F P12G1825-F P20G1825-F P10R1221-F P10R1821-F P30R4731-F P10R4735-F P10R6821-F P30R8231-F P30G5625-F P10G6815-F P10R4721-F P20R2231-F P20R2731-F P20R1045-F P20R1531-F P20R8235-F P10R1835-F P30G8225-F P40R3945-F
Description Multilayer Ceramic Capacitors
   Multilayer Ceramic Capacitors
File Size 158.41K  /  3 Page

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Amphenol Communications Solutions
Part No. RJE1R2882354A3
Description Modular Jacks, Input Output Connectors, 8P8C, Cat5e over Cat6, Stacked, Shield, With LEDs
Tech specs 　 　

Official Product Page

    Renesas Electronics Corporation.
Renesas Electronics, Corp.
Part No. M38230G4-XXXFP M38230G4-XXXHP M38231G4-XXXHP M38232G4-XXXFP M38232G4-XXXHP M38233G4-XXXFP M38233G4-XXXHP M38234G4-XXXFP M38234G4-XXXHP M38235G4-XXXFP M38230G6-XXXFP M38230G6-XXXHP M38231G6-XXXFP M38231G6-XXXHP M38232G6-XXXFP M38232G6-XXXHP M38233G6-XXXFP M38233G6-XXXHP M38234G6-XXXFP M38234G6-XXXHP M38235G6-XXXFP M38235G6-XXXHP M38236G6-XXXHP M38237G6-XXXFP M38237G6-XXXHP M38238G6-XXXFP M38230G7-XXXFP M38230G7-XXXHP M38231G7-XXXFP M38231G7-XXXHP M38232G7-XXXFP M38232G7-XXXHP M38233G7-XXXFP M38233G7-XXXHP M38234G7-XXXFP M38234G7-XXXHP M38235G7-XXXFP M38235G7-XXXHP M38236G7-XXXFP M38236G7-XXXHP M38237G7-XXXFP M38237G7-XXXHP M38238G7-XXXFP M38238G7-XXXHP M38239G7-XXXFP M38239G7-XXXHP M38230G8-XXXFP M38230G8-XXXHP M38231G8-XXXFP M38231G8-XXXHP M38232G8-XXXFP M38232G8-XXXHP M38233G8-XXXFP M38233G8-XXXHP M38234G8-XXXFP M38234G8-XXXHP M38235G8-XXXFP M38235G8-XXXHP M38236G8-XXXFP M38236G8-XXXHP M38237G8-XXXFP M38237G8-XXXHP M38238G8-XXXFP M38238G8-XXXHP M38230GA-XXXFP M38230GA-XXXHP M38231GA-XXXFP M38231GA-XXXHP M38232GA-XXXFP M38232GA-XXXHP M38233GA-XXXFP M38233GA-XXXHP M38234GA-XXXFP M38234GA-XXXHP M38235GA-XXXFP M38235GA-XXXHP M38236GA-XXXFP M38236GA-XXXHP M38237GA-XXXFP M38237GA-XXXHP
Description 18-Mbit (512K x 36/1M x 18) Flow-Through SRAM; Architecture: Standard Sync, Flow-through; Density: 18 Mb; Organization: 512Kb x 36; Vcc (V): 3.1 to 3.6 V
36-Mbit QDR(TM)-II SRAM 4-Word Burst Architecture; Architecture: QDR-II, 4 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V
36-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 1.7 to 1.9 V
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 2.4 to 2.6 V
72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 3.1 to 3.6 V
18-Mbit (512K x 36/1M x 18) Pipelined SRAM; Architecture: Standard Sync, Pipeline SCD; Density: 18 Mb; Organization: 1Mb x 18; Vcc (V): 3.1 to 3.6 V
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 3.1 to 3.6 V
72-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V
18-Mbit (512K x 36/1M x 18) Flow-Through SRAM; Architecture: Standard Sync, Flow-through; Density: 18 Mb; Organization: 1Mb x 18; Vcc (V): 3.1 to 3.6 V
36-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 1.7 to 1.9 V
36-Mbit (1M x 36/2 M x 18/512K x 72) Flow-Through SRAM with NoBL(TM) Architecture; Architecture: NoBL, Flow-through; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 3.1 to 3.6 V
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 1Mb x 72; Vcc (V): 2.4 to 2.6 V
72-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined Sync SRAM; Architecture: Standard Sync, Pipeline SCD; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 3.1 to 3.6 V
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 3.1 to 3.6 V
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 36 Mb; Organization: 512Kb x 72; Vcc (V): 3.1 to 3.6 V
72-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V
Sync SRAM; Architecture: QDR-II, 2 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V
36-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 2.4 to 2.6 V
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 2.4 to 2.6 V
72-Mbit QDR(TM)-II SRAM 4-Word Burst Architecture; Architecture: QDR-II, 4 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V
72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 1Mb x 72; Vcc (V): 3.1 to 3.6 V
72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined Sync SRAM; Architecture: Standard Sync, Pipeline SCD; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 2.4 to 2.6 V
72-Mbit QDR(TM)-II SRAM 4-Word Burst Architecture (2.5 Cycle Read Latency); Architecture: QDR-II , 4 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V
72-Mbit DDR-II SRAM 2-Word Burst Architecture (2.0 Cycle Read Latency); Architecture: DDR-II CIO, 2 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined Sync SRAM; Architecture: Standard Sync, Pipeline SCD; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 3.1 to 3.6 V 单芯位CMOS微机
72-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机
18-Mbit (512K x 36/1M x 18) Flow-Through SRAM; Architecture: Standard Sync, Flow-through; Density: 18 Mb; Organization: 1Mb x 18; Vcc (V): 3.1 to 3.6 V 单芯位CMOS微机
SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER 单芯位CMOS微机
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 2.4 to 2.6 V 单芯位CMOS微机
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 2.4 to 2.6 V 单芯位CMOS微机
72-Mbit QDR(TM)-II SRAM 4-Word Burst Architecture; Architecture: QDR-II, 4 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机
72-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机
36-Mbit QDR(TM)-II SRAM 4-Word Burst Architecture; Architecture: QDR-II, 4 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机
SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER 单芯8位CMOS微机
Sync SRAM; Architecture: QDR-II, 2 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机
36-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机
72-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V
36-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V
File Size 901.80K  /  76 Page

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Amphenol Communications Solutions
Part No. RJE1R2882354F3
Description Modular Jacks, Input Output Connectors, 8P8C, Cat5e over Cat6, Stacked, Shield, With LEDs
Tech specs 　 　

Official Product Page

    M3823AGF-XXXHP 3823 M38230G1-XXXFP M38230G1-XXXHP M38230G2-XXXFP M38230G2-XXXHP M38230G3-XXXFP M38230G3-XXXHP M38230G4-X

RENESAS[Renesas Electronics Corporation]
Part No. M3823AGF-XXXHP 3823 M38230G1-XXXFP M38230G1-XXXHP M38230G2-XXXFP M38230G2-XXXHP M38230G3-XXXFP M38230G3-XXXHP M38230G4-XXXFP M38230G4-XXXHP M38230G5-XXXFP M38230G5-XXXHP M38230G6-XXXFP M38230G6-XXXHP M38230G7-XXXFP M38230G7-XXXHP M38230G8-XXXFP M38230G8-XXXHP M38230G9-XXXFP M38230G9-XXXHP M38230GA-XXXFP M38230GA-XXXHP M38230GB-XXXFP M38230GB-XXXHP M38230GC-XXXFP M38230GC-XXXHP M38230GD-XXXFP M38230GD-XXXHP M38230GE-XXXFP M38230GE-XXXHP M38230GF-XXXFP M38230GF-XXXHP M38231G1-XXXFP M38231G1-XXXHP M38231G2-XXXFP M38231G2-XXXHP M38231G3-XXXFP M38231G3-XXXHP M38231G4-XXXFP M38231G4-XXXHP M38231G5-XXXFP M38231G5-XXXHP M38231G6-XXXFP M38231G6-XXXHP M38231G7-XXXFP M38231G7-XXXHP M38231G8-XXXFP M38231G8-XXXHP M38231G9-XXXFP M38231G9-XXXHP M38231GA-XXXFP M38231GA-XXXHP M38231GB-XXXFP M38231GB-XXXHP M38231GC-XXXFP M38231GC-XXXHP M38231GD-XXXFP M38231GD-XXXHP M38231GE-XXXFP M38231GE-XXXHP M38231GF-XXXFP M38231GF-XXXHP M38232G1-XXXFP M38232G1-XXXHP M38232G2-XXXFP M38232G2-XXXHP M38232G3-XXXFP M38232G3-XXXHP M38232G4-XXXFP M38232G4-XXXHP M38232G5-XXXFP M38232G5-XXXHP M38232G6-XXXFP M38232G6-XXXHP M38232G7-XXXFP M38232G7-XXXHP M38232G8-XXXFP M38232G8-XXXHP M38232G9-XXXFP M38232G9-XXXHP M38232GA-X
Description SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER
File Size 877.42K  /  76 Page

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Amphenol Communications Solutions
Part No. RJE1R2882354L3
Description Modular Jacks, Input Output Connectors, 8P8C, Cat5e over Cat6, Stacked, Shield, With LEDs
Tech specs 　 　

Official Product Page

    P10G3901-F P10G2701-F P10G8201-F P10G4701-F P10G5615-F P12G2225-F P20G2225-F P20G1821-F P10R1821-F P10G2712-F P20G2221-F

Cornell Dubilier Electr...
Cornell Dubilier Electronics
http://
Cornell Dubilier Electronic...
Part No. P10G3901-F P10G2701-F P10G8201-F P10G4701-F P10G5615-F P12G2225-F P20G2225-F P20G1821-F P10R1821-F P10G2712-F P20G2221-F P10R2221-F P30G8221-F P10R8221-F P10G2202-F P30R2245-F P40G1535-F P10R1535-F P12G1825-F P20G1825-F P30G8225-F P10R8225-F P30G5621-F P10R5621-F P30G3321-F P10R3321-F P30G5625-F P40R3345-F P10G1511-F P40G1231-F P10R1231-F P10G4702-F P30R1845-F P10G1211-F P10G1212-F P30R4731-F P10R4735-F P10G8202-F P10G3311-F P10G6815-F P30G6821-F P30G6825-F P10R2235-F P40R1241-F P40R1541-F P10R4721-F P10R5611-F P30R2745-F P10G8215-F P30R5631-F P12R5635-F P20R5635-F P10G3902-F P30R6831-F P10G1202-F P10R2735-F P10G6802-F P10G1021-F P10G1025-F P12G1525-F P20G1525-F P12G2725-F P30G2725-F P10G3302-F P20R3331-F P10R1221-F P10R1235-F P40G1235-F P30G3325-F P12R2731-F P20R2731-F P10G5611-F P10G4711-F P10G5602-F P40G1531-F P40R4745-F P20G1221-F P30R1245-F P10R1021-F P10R1031-F P10R1035-F P10G2711-F P10G8211-F P10R8211-F P12R6835-F P20R6835-F P10R6821-F P40G1035-F P20G1521-F P12R1831-F P20R1831-F P10R1835-F P12R8235-F P10G1812-F P10G2211-F P10G2212-F P30R1041-F P10R4711-F P30G3921-F P30G3925-F P10G3911-F P10R2721-F P10R6811-F P12R2231-F P20R2231-F P20R1045-F P20R1531-F P30R3931-F P40G1031-F P
Description    Multilayer Ceramic Capacitors
File Size 158.05K  /  3 Page

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Amphenol Communications Solutions
Part No. RJE1R2882354T3
Description Modular Jacks, Input Output Connectors, 8P8C, Cat5e over Cat6, Stacked, Shield, With LEDs
Tech specs 　 　

Official Product Page

    M22U8235 M15G1002 M15G1012 M15G1021 M15G109D2 M15G1202 M15G1211 M15G1212 M15G1502 M15G1511 M15G1512 M15G159D2 M15G1802 M

List of Unclassifed Man...
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List of Unclassifed Manufacturers
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List of Unclassifed Manufac...
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Description    Multilayer Ceramic Capacitors
File Size 35.92K  /  4 Page

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Amphenol Communications Solutions
Part No. 48235-000LF
Description PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle.
Tech specs 　 　

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Price and Availability


JITONG TECHNOLOGY
(CHINA HK & SZ)
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Part: 82380-16
Maker: N/A
Pack: N/A
Stock: 100
Unit price for :
    50: $40.62
  100: $38.58
1000: $36.55

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Price & Availability of 8235

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