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  73780-3163 Datasheet PDF File

For 73780-3163 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |   

    73780-0153 0737800153

Molex Electronics Ltd.
Part No. 73780-0153 0737800153
Description 2.00mm (.079) Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 72 Circuits

File Size 202.01K  /  3 Page

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Amphenol Communications Solutions

Part No. 61083-163402PLF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    73780-3864 0737803864

Molex Electronics Ltd.
Part No. 73780-3864 0737803864
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 144 Circuits, Mounted Height 14.00mm (.551), Pin Length 4.00mm (.157),

File Size 201.55K  /  3 Page

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Amphenol Communications Solutions

Part No. 91901-31631LF
Description Conan® 1.00mm Pitch, Board To Board Connector, I - Industrial Series, Vertical Header, Surface Mount, 31 Positions.
Tech specs    

Official Product Page

    73780-0143 0737800143

Molex Electronics Ltd.
Part No. 73780-0143 0737800143
Description 2.00mm (.079) Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 72 Circuits

File Size 202.00K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-6316-21D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Left End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    73780-0145 0737800145

Molex Electronics Ltd.
Part No. 73780-0145 0737800145
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 15.00mm (.591), Pin Length 3.00mm (.118),

File Size 201.76K  /  3 Page

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Amphenol Communications Solutions

Part No. 75168-316-36LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0737800163 73780-0163

Molex Electronics Ltd.
Part No. 0737800163 73780-0163
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 13.00mm (.512), Pin Length 2.50mm (.098),

File Size 202.01K  /  3 Page

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Amphenol Communications Solutions

Part No. 61083-163400LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

    73780-0147 0737800147

Molex Electronics Ltd.
Part No. 73780-0147 0737800147
Description 2.00mm (.079) Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 72 Circuits

File Size 201.79K  /  3 Page

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Amphenol Communications Solutions

Part No. 61083-163422LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

    73780-0123 0737800123

Molex Electronics Ltd.
Part No. 73780-0123 0737800123
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 72 Circuits, Mounted Height 13.00mm (.512), Pin Length 2.50mm (.098),Solder Tail

File Size 201.99K  /  3 Page

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Amphenol Communications Solutions

Part No. 61083-163402LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

    73780-0144 0737800144

Molex Electronics Ltd.
Part No. 73780-0144 0737800144
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 14.00mm (.551), Pin Length 3.00mm (.118),

File Size 201.76K  /  3 Page

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Amphenol Communications Solutions

Part No. 61083-163622LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

    OKI
Part No. MSM531632F
Description 1,048,576-Word x 16-Bit or 2,097,152-Word x 8-Bit MASKROM
From old datasheet system

File Size 72.94K  /  9 Page

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Amphenol Communications Solutions

Part No. 131-6314-11H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 4 Column, Left End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    OKI
Part No. MSM531632E
Description 1,048,576-Word x 16-Bit or 2,097,152-Word x 8-Bit MASKROM
From old datasheet system

File Size 73.05K  /  9 Page

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Amphenol Communications Solutions

Part No. 131-6318-21D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Left End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

For 73780-3163 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |   

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