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  70287-1011 Datasheet PDF File

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    70287-1018 0702871018

Molex Electronics Ltd.
Part No. 70287-1018 0702871018
Description 2.54mm (.100") Pitch C-Grid Header, Breakaway, Dual Row, Vertical, with Retention Pin, 40 Circuits
2.54mm (.100) Pitch C-Grid Header, Breakaway, Dual Row, Vertical, with Retention Pin, 40 Circuits

File Size 308.31K  /  6 Page

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Amphenol Communications Solutions

Part No. 10118085-101-12LF
Description Unshrouded Right Angle header,Surface Mount, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    70287-1017 0702871017

Molex Electronics Ltd.
Part No. 70287-1017 0702871017
Description 2.54mm (.100") Pitch C-Grid庐 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 38 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 38 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating

File Size 308.32K  /  6 Page

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Amphenol Communications Solutions

Part No. 10119333-101-15LF
Description BergStik®, Board to Board connector, Unshrouded horizontal header, Surface mount, Single Row, 15 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    70287-1016 0702871016

Molex Electronics Ltd.
Part No. 70287-1016 0702871016
Description 2.54mm (.100") Pitch C-Grid Header, Breakaway, Dual Row, Vertical, with Retention Pin, 36 Circuits, 6.10mm
2.54mm (.100) Pitch C-Grid Header, Breakaway, Dual Row, Vertical, with Retention Pin, 36 Circuits, 6.10mm

File Size 308.32K  /  6 Page

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Amphenol Communications Solutions

Part No. 10114829-10110LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 10 Positions
Tech specs    

Official Product Page

    70287-1003 0702871003

Molex Electronics Ltd.
Part No. 70287-1003 0702871003
Description 2.54mm (.100") Pitch C-Grid庐 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 10 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 10 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating

File Size 308.32K  /  6 Page

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Amphenol Communications Solutions

Part No. 10114831-10113LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 13 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    0702871217 70287-1217

Molex Electronics Ltd.
Part No. 0702871217 70287-1217
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 46 Circuits, 6.10mm (.240) Mating Pin Length, 0.76μm (30μ) Gold (Au) Selective
2.54mm (.100") Pitch C-Grid垄莽 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 46 Circuits, 6.10mm (.240") Mating Pin Length, 0.76楼矛m (30楼矛") Gold (Au)

File Size 308.50K  /  6 Page

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Amphenol Communications Solutions

Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    0702871218 70287-1218

Molex Electronics Ltd.
Part No. 0702871218 70287-1218
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 48 Circuits, 6.10mm (.240) Mating Pin Length, 0.76μm (30μ) Gold (Au) Selective
2.54mm (.100") Pitch C-Grid垄莽 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 48 Circuits, 6.10mm (.240") Mating Pin Length, 0.76楼矛m (30楼矛") Gold (Au)

File Size 308.50K  /  6 Page

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Amphenol Communications Solutions

Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs    

Official Product Page

    0702871219 70287-1219

Molex Electronics Ltd.
Part No. 0702871219 70287-1219
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 50 Circuits, 6.10mm (.240) Mating Pin Length, 0.76μm (30μ) Gold (Au) Selective
MOLEX Connector

File Size 308.50K  /  6 Page

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Amphenol Communications Solutions

Part No. 10114828-10115LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 15 Positions
Tech specs    

Official Product Page

    0702871220 70287-1220

Molex Electronics Ltd.
Part No. 0702871220 70287-1220
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 52 Circuits, 6.10mm (.240) Mating Pin Length, 0.76μm (30μ) Gold (Au) Selective
2.54mm (.100") Pitch C-Grid垄莽 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 52 Circuits, 6.10mm (.240") Mating Pin Length, 0.76楼矛m (30楼矛") Gold (Au)

File Size 308.52K  /  6 Page

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Amphenol Communications Solutions

Part No. 10114830-10111LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 11 Positions
Tech specs    

Official Product Page

    http://
Part No. 0702871043
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 90 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating

File Size 308.20K  /  6 Page

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Amphenol Communications Solutions

Part No. 10114829-10115LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 15 Positions
Tech specs    

Official Product Page

    0702871236

Molex Electronics Ltd.
Part No. 0702871236
Description 2.54mm (.100") Pitch C-Grid庐 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 84 Circuits, 6.10mm (.240") Mating Pin Length, 0.76渭m (30渭") Gold (Au) Se

File Size 308.23K  /  6 Page

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Amphenol Communications Solutions

Part No. 10114831-10115LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 15 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

For 70287-1011 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |   

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