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  68145-2811 Datasheet PDF File

For 68145-2811 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |   

    0022281171

Molex Electronics Ltd.
Part No. 0022281171
Description 2.54mm (.100) Pitch KK? Header, Breakaway, Right Angle, with Friction Lock, 17 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 311.15K  /  8 Page

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Amphenol Communications Solutions

Part No. 10114828-11206LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 6 Positions
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    51281-1094 0512811094

Molex Electronics Ltd.
Part No. 51281-1094 0512811094
Description 0.50mm (.020) Pitch FFC/FPC Connector, SMT, Right Angle, Non-ZIF, Dual ContactStyle, 1.20mm (.047) Mated Height, 10 Circuits, Lead-free, Gold (Au) Plating

File Size 435.25K  /  8 Page

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Amphenol Communications Solutions

Part No. 54112-811121900LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    22-28-1131 0022281131

Molex Electronics Ltd.
Part No. 22-28-1131 0022281131
Description 2.54mm (.100) Pitch KK? Header, Breakaway, Right Angle, with Friction Lock, 13 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 311.14K  /  8 Page

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Amphenol Communications Solutions

Part No. 10114828-11115LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 15 Positions
Tech specs    

Official Product Page

    39-28-1103 0039281103

Molex Electronics Ltd.
Part No. 39-28-1103 0039281103
Description 4.20mm (.165) Pitch Mini-Fit Jr. Header, Dual Row, Vertical, without Snap-in Plastic Peg PCB Lock

File Size 499.94K  /  6 Page

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Amphenol Communications Solutions

Part No. 10114828-11110LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 10 Positions
Tech specs    

Official Product Page

    39-28-1123 0039281123

Molex Electronics Ltd.
Part No. 39-28-1123 0039281123
Description 4.20mm (.165) Pitch Mini-Fit Jr. Header, Dual Row, Vertical, without Snap-in Plastic Peg PCB Lock, 12 Circuits

File Size 500.20K  /  6 Page

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Amphenol Communications Solutions

Part No. 54112-811042400LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0512811494 51281-1494

Molex Electronics Ltd.
Part No. 0512811494 51281-1494
Description 0.50mm (.020) Pitch FFC/FPC Connector, SMT, Right Angle, Non-ZIF, Dual ContactStyle, 1.20mm (.047) Mated Height, 14 Circuits, Lead-free, Gold (Au) Plating
0.50mm (.020") Pitch FFC/FPC Connector, SMT, Right Angle, Non-ZIF, Dual ContactStyle, 1.20mm (.047") Mated Height, 14 Circuits, Lead-free, Gold (Au) Plating

File Size 435.34K  /  8 Page

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Amphenol Communications Solutions

Part No. 54122-811161900LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0022281130-17

Molex Electronics Ltd.
Part No. 0022281130-17
Description    KK 254 Breakaway Header, Right-Angle with Friction Lock, 13 Circuits, Tin (Sn) Plating

File Size 39.04K  /  2 Page

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Amphenol Communications Solutions

Part No. 54122-811401800LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 40 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0022281131-17

Molex Electronics Ltd.
Part No. 0022281131-17
Description    KK 254 Breakaway Header, Right-Angle with Friction Lock, 13 Circuits, 0.38m

File Size 39.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114828-11106LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 6 Positions
Tech specs    

Official Product Page

    0432028113-17

Molex Electronics Ltd.
Part No. 0432028113-17
Description    Modular Jack, Right Angle, Low Profile, 8/8, Key

File Size 26.84K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114828-11108LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 8 Positions
Tech specs    

Official Product Page

    ASM3P2811B

ON Semiconductor
Part No. ASM3P2811B
Description Low Power EMI Reduction IC

File Size 128.00K  /  9 Page

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Amphenol Communications Solutions

Part No. 54242-811162350LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 68145-2811 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |   

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