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  5323 Datasheet PDF File

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    0039532304 5597-30APB7F

Molex Electronics Ltd.
Part No. 0039532304 5597-30APB7F
Description 1.25mm (.049) Pitch FFC/FPC Connector, Through-Hole, Right Angle, ZIF, Top Contact Style
1.25mm (.049") Pitch FFC/FPC Connector, Through-Hole, Right Angle, ZIF, Top Contact Style
MOLEX Connector

File Size 154.01K  /  4 Page

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Amphenol Communications Solutions

Part No. 10136647-053232LF
Description Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, LCP, 15u\\ Gold (Tin on Tails) plating, Black Color, 5 Positions, GW Compatible, with out Posts, Tray packing.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    M22-2531705 M22-2532146 M22-2532346 M22-2531046

Harwin PLC
Part No. M22-2531705 M22-2532146 M22-2532346 M22-2531046
Description 2.00mm Pitch SIL Horizontal 2.4mm PC Tail Pin Header, 3.5mm mating pin height, gold, 17-way 17 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER, PLUG
2.00mm Pitch SIL Horizontal 2.4mm PC Tail Pin Header, 3.5mm mating pin height, tin, 21-way 21 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
2.00mm Pitch SIL Horizontal 2.4mm PC Tail Pin Header, 3.5mm mating pin height, tin, 23-way 23 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
2.00mm Pitch SIL Horizontal 2.4mm PC Tail Pin Header, 3.5mm mating pin height, tin, 10-way 10 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER

File Size 75.25K  /  1 Page

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Amphenol Communications Solutions

Part No. 68653-236HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    M53230800CB0

Samsung Semiconductor
Part No. M53230800CB0
Description (M532308x0CB0/CW0) DRAM Module

File Size 428.44K  /  15 Page

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Amphenol Communications Solutions

Part No. 51915-323LF
Description PwrBlade®, Power Connectors, 12S 17P Right Angle Receptacle, Solder To Board
Tech specs    

Official Product Page

    M53230400DB0

Samsung Semiconductor
Part No. M53230400DB0
Description (M532304x0DB0/DW0) DRAM Module

File Size 429.26K  /  15 Page

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Amphenol Communications Solutions

Part No. 379-5323-200
Description PLUG,INFINX 6 Pair,14 Position,8.0MM, 100MΩ, w/lossy
Tech specs    

Official Product Page

    M53233200CE0

Samsung Semiconductor
Part No. M53233200CE0
Description (M53233200CE0/CJ0-C) DRAM Module

File Size 565.61K  /  21 Page

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Amphenol Communications Solutions

Part No. 88953-231LF
Description Metral® Board Connectors, Backplane Connectors, 4 Row Signal Header, Straight, Solder-to-Board, Wide body.
Tech specs    

Official Product Page

    M53230804BT0-C

Samsung Semiconductor
Part No. M53230804BT0-C
Description (M53230804BT0-C/BY0) DRAM Module

File Size 554.35K  /  21 Page

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Amphenol Communications Solutions

Part No. 88953-235LF
Description Metral® Board Connectors, Backplane Connectors, 4 Row Signal Header, Straight, Solder-to-Board, Wide body.
Tech specs    

Official Product Page

    M53230804CT0-C

Samsung Semiconductor
Part No. M53230804CT0-C
Description (M53230804CT0-C/CY0) DRAM Module

File Size 554.37K  /  21 Page

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Amphenol Communications Solutions

Part No. 75915-323LF
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Single Row, Top Entry, 23 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    M53230224DE2

Samsung Semiconductor
Part No. M53230224DE2
Description (M53230224DE2/DJ2) DRAM Module

File Size 427.93K  /  15 Page

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Amphenol Communications Solutions

Part No. 76745-323-72LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 72 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    M53230404CT0-C

Samsung Semiconductor
Part No. M53230404CT0-C
Description (M53230404CT0/CY0) DRAM Module

File Size 550.91K  /  21 Page

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Amphenol Communications Solutions

Part No. 91615-323LF
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Surface Mount, Dual Entry, Double row , 46 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    M53233200BE0

Samsung Semiconductor
Part No. M53233200BE0
Description (M53233200BE0/BJ0-C) DRAM Module

File Size 565.95K  /  21 Page

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Amphenol Communications Solutions

Part No. 75915-323HLF
Description Dubox® 2.54mm, Board to Board Connector,Vertical Receptacle, Through Hole, Single row , 23 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

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Part: 5328
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