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  43045-0826 Datasheet PDF File

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    MOLEX INC
Part No. 43045-0205
Description POWER CONNECTOR
File Size 67.23K  /  1 Page

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Amphenol Communications Solutions
Part No. 10093084-3045HFLF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, Halogen free
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    43045-1206

Molex Electronics Ltd.
Part No. 43045-1206
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 12 Circuits
File Size 184.20K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045LF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, non-halogen free
Tech specs 　 　

Official Product Page

    43045-1200

Molex Electronics Ltd.
Part No. 43045-1200
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 12 Circuits
File Size 190.60K  /  3 Page

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Amphenol Communications Solutions
Part No. 75160-826-04LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,4 position, 2.54mm pitch
Tech specs 　 　

Official Product Page

    43045-1201

Molex Electronics Ltd.
Part No. 43045-1201
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 12 Circuits
File Size 190.63K  /  3 Page

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Amphenol Communications Solutions
Part No. 54242-108261800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    43045-1221

Molex Electronics Ltd.
Part No. 43045-1221
Description
File Size 183.78K  /  3 Page

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Amphenol Communications Solutions
Part No. 61083-082602LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 80 Positions.
Tech specs 　 　

Official Product Page

    43045-1220

Molex Electronics Ltd.
Part No. 43045-1220
Description
File Size 175.81K  /  3 Page

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Amphenol Communications Solutions
Part No. 54112-808260900LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    43045-1209

Molex Electronics Ltd.
Part No. 43045-1209
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 12 Circuits
File Size 176.77K  /  3 Page

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Amphenol Communications Solutions
Part No. 61083-082606LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 80 Positions.
Tech specs 　 　

Official Product Page

    43045-1800

Molex Electronics Ltd.
Part No. 43045-1800
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 18 Circuits
File Size 190.60K  /  3 Page

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Amphenol Communications Solutions
Part No. 61083-082600LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 80 Positions.
Tech specs 　 　

Official Product Page

    43045-1809

Molex Electronics Ltd.
Part No. 43045-1809
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 18 Circuits
File Size 176.77K  /  3 Page

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Amphenol Communications Solutions
Part No. 61082-082600LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 80 Positions.
Tech specs 　 　

Official Product Page

    43045-0602

Molex Electronics Ltd.
Part No. 43045-0602
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 6 Circuits
File Size 190.63K  /  3 Page

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Amphenol Communications Solutions
Part No. 61082-082602LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 80 Positions.
Tech specs 　 　

Official Product Page

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