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  43045-0806 Datasheet PDF File

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    43045-0824

Molex Electronics Ltd.
Part No. 43045-0824
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with Press-fit Metal Retention Clip, 8 Circuits
File Size 182.72K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045HFLF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, Halogen free
Tech specs 　 　

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HUA FENG CIRCUIT





    43045-0221

Molex Electronics Ltd.
Part No. 43045-0221
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Press-fit Metal Retention Clip
File Size 183.81K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045LF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, non-halogen free
Tech specs 　 　

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    43045-0825

Molex Electronics Ltd.
Part No. 43045-0825
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with Press-fit Metal Retention Clip, 8 Circuits
File Size 182.53K  /  3 Page

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Amphenol Communications Solutions
Part No. 54202-G08-06P
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 12 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

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    43045-0826

Molex Electronics Ltd.
Part No. 43045-0826
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with Press-fit Metal Retention Clip, 8 Circuits
File Size 182.76K  /  3 Page

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Amphenol Communications Solutions
Part No. 75160-806-10LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,10 position, 2.54mm pitch
Tech specs 　 　

Official Product Page

    43045-1819

Molex Electronics Ltd.
Part No. 43045-1819
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Solder Tab, 18 Circuits
File Size 175.82K  /  3 Page

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Amphenol Communications Solutions
Part No. 57102-F08-06LF
Description Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 12 Positions - 2mm (0.079inch) - Vertical
Tech specs 　 　

Official Product Page

    ONSEMI[ON Semiconductor]
Part No. J308 J308_06 J30806
Description JFET VHF/UHF Amplifiers
File Size 187.12K  /  6 Page

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Amphenol Communications Solutions
Part No. 54102-G0806LF
Description 54102-G0806LF-DUPLEX
Tech specs 　 　

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    T0806 T0806-PEQG T0806-TCQ

Atmel Corp.
ATMEL[ATMEL Corporation]
Part No. T0806 T0806-PEQG T0806-TCQ
Description TERMINAL
3 CHANNEL LASER DRIVER WITH RF OSCILLATOR AND 2 OUTPUTS
File Size 220.89K  /  7 Page

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Amphenol Communications Solutions
Part No. 54122-101080600RLF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

    SDM-08060-B1F SDM-08060-B1FY

SIRENZA MICRODEVICES
Part No. SDM-08060-B1F SDM-08060-B1FY
Description 869-894 MHz Class AB 65W Power Amplifier Module
File Size 118.20K  /  5 Page

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Amphenol Communications Solutions
Part No. 68020-408-061033LF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

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    List of Unclassifed Man...
Part No. OVS-0803 OVS-0801 OVS-0806 OVS-0804
Description SMD Super Bright LED
File Size 106.79K  /  1 Page

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Amphenol Communications Solutions
Part No. 10142708-06200LF
Description Minitek®Pwr 5.7, Vertical Through Hole Header, Dual Row, Black Color, 6 Positions, 100u\\ Tin overall plating, GW Compatible LCP, With Pegs, Tray.
Tech specs 　 　

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    0806SQ-19N

Coilcraft lnc.
Part No. 0806SQ-19N
Description Square Air Core Inductors
File Size 250.03K  /  3 Page

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Amphenol Communications Solutions
Part No. 54112-808061500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

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