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  2816-4 Datasheet PDF File

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    EVAL-ADN2816EBZ

Analog Devices
Part No. EVAL-ADN2816EBZ
Description Continuous Rate 10 Mb/s to 675 Mb/s Clock and Data Recovery IC
File Size 390.57K  /  24 Page

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Amphenol Communications Solutions
Part No. 54122-816523000LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 52 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    K4S281633D-N1H K4S281633D-N1L K4S281633D-N75 K4S281633D-RL

SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S281633D-N1H K4S281633D-N1L K4S281633D-N75 K4S281633D-RL
Description IC REG ULDO DUAL 2.8/1.5V 6-MLF
8Mx16 SDRAM 54CSP
2M x 16Bit x 4 Banks SDRAM in 54CSP Data Sheet
File Size 66.22K  /  10 Page

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Amphenol Communications Solutions
Part No. 54122-128161250LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

    Samsung Electronics Inc
Part No. K4S281632F-TC75
Description DRAM (Dynamic RAM) - Datasheet Reference
File Size 107.60K  /  10 Page

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Amphenol Communications Solutions
Part No. 77315-428-16LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs 　 　

Official Product Page

    3M Company
Part No. K4M28163PD-RS1L K4M28163PD-BS1L
Description 8M X 16 SYNCHRONOUS DRAM, 7 ns, PBGA54 CSP-54
File Size 64.58K  /  8 Page

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Amphenol Communications Solutions
Part No. 68682-816
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Through Hole, Dual Entry, Double Row, 32 Position ,2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

   
Part No. DM5516AH-200 DM2816AH-150 DM2816AH-200
Description 2K X 8 EEPROM 5V, 200 ns, CDIP24
2K X 8 EEPROM 5V, 150 ns, CDIP24
File Size 191.36K  /  6 Page

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Amphenol Communications Solutions
Part No. 59202-S28-16-050LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 32 Positions.
Tech specs 　 　

Official Product Page

    Samsung Electronic
Part No. K4S281632E-TC7C K4S281632E-TL7C
Description 2M x 16bit x 4 banks synchronous DRAM LVTTL, 133MHz
File Size 59.25K  /  11 Page

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Amphenol Communications Solutions
Part No. 54112-816202500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

   
Part No. KFG2816Q1M-DEB00
Description 8M X 16 FLASH 1.8V PROM, 76 ns, PBGA67
File Size 1,168.99K  /  88 Page

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Amphenol Communications Solutions
Part No. 54122-816202500LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

   
Part No. KFG2816U1M-PIB00
Description 8M X 16 FLASH 3.3V PROM, 76 ns, PDSO48
File Size 1,004.64K  /  80 Page

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Amphenol Communications Solutions
Part No. 54242-816062600LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Stacking vertical header, Surface Mount, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    http://
Part No. ACT-SF2816N-39F18C ACT-SF2816N-39F18I ACT-SF2816N-39F18M ACT-SF2816N-39F18Q ACT-SF2816N-39F18T
Description ACT-SF2816 High Speed 128Kx16 SRAM / 512Kx16 FLASH Multichip Module
File Size 183.27K  /  11 Page

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Amphenol Communications Solutions
Part No. 54112-816122500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    K4M28163LF K4M28163LF-C K4M28163LF-L K4M28163LF-N K4M28163LF-R1L K4M28163LF-R75 K4M28163LF-RE K4M28163LF-S K4M28163LF-BR

SAMSUNG[Samsung semiconductor]
Samsung Electronic
SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K4M28163LF K4M28163LF-C K4M28163LF-L K4M28163LF-N K4M28163LF-R1L K4M28163LF-R75 K4M28163LF-RE K4M28163LF-S K4M28163LF-BR750
Description 2M x 16Bit x 4 Banks Mobile SDRAM in 54FBGA 200万16 × 4银行4FBGA移动SDRAM
8M X 16 SYNCHRONOUS DRAM, 5.4 ns, PBGA54
File Size 112.71K  /  12 Page

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Amphenol Communications Solutions
Part No. 59112-G28-16-050LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 32 Positions.
Tech specs 　 　

Official Product Page

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