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  1140-5254 Datasheet PDF File

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    001140-4323 0011-40-4323

Molex Electronics Ltd.
Part No. 001140-4323 0011-40-4323
Description Insulation Punch

File Size 14.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 1140084168
Description 1140084168-Micro SD Normal Open H=1.55 NONE PUSH
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    11-40-2015 1140-2015 0011-40-2015 001140-2015

Molex Electronics Ltd.
Part No. 11-40-2015 1140-2015 0011-40-2015 001140-2015
Description Terminator Die

File Size 19.96K  /  1 Page

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Amphenol Communications Solutions

Part No. 89075-254LF
Description 4 Row Signal Header, Straight, Press-Fit, 4 Mod
Tech specs    

Official Product Page

    11-40-4409 0011-40-4409 1140-4409 001140-4409

Molex Electronics Ltd.
Part No. 11-40-4409 0011-40-4409 1140-4409 001140-4409
Description Insulation Punch

File Size 14.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-401-00LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 00 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    1140-4200 0011-40-4200 001140-4200

Molex Electronics Ltd.
Part No. 1140-4200 0011-40-4200 001140-4200
Description Conductor Punch

File Size 14.32K  /  1 Page

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Amphenol Communications Solutions

Part No. 78511-403HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 3 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    1140-4203 001140-4203 0011-40-4203

Molex Electronics Ltd.
Part No. 1140-4203 001140-4203 0011-40-4203
Description Conductor Punch

File Size 14.32K  /  1 Page

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Amphenol Communications Solutions

Part No. 87401-140LF
Description Rib-Cage® Board To Board Connector, Surface Mount Vertical Shrouded PCB Header, 80 Positions, Plain Mounting style.
Tech specs    

Official Product Page

    TA75254 TA75254P

TOSHIBA[Toshiba Semiconductor]
Part No. TA75254 TA75254P
Description SINGLE OPERATIONAL AMPLIFIER

File Size 234.83K  /  6 Page

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Amphenol Communications Solutions

Part No. 10027011-408HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Surface Mount, Single Row, 8 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    NXP Semiconductors N.V.
Part No. SAA5254P SAA5254
Description Integrated VIP and teletext decoder IVT1.1X TELETEXT DECODER, PDIP40

File Size 805.08K  /  36 Page

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Amphenol Communications Solutions

Part No. 10027011-402HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Surface Mount, Single Row, 2 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    SAA5254 SAA5254P

PHILIPS[Philips Semiconductors]
Part No. SAA5254 SAA5254P
Description Integrated VIP and teletext decoder IVT1.1X

File Size 798.00K  /  36 Page

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Amphenol Communications Solutions

Part No. 54122-111140850LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 14 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    MIC5254 MIC5254-SJBMM

Micrel Semiconductor,Inc.
Part No. MIC5254 MIC5254-SJBMM
Description From old datasheet system
DUAL 150MA UCAP LDO WITH ERROR FLAG OUTPUTS

File Size 157.72K  /  11 Page

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Amphenol Communications Solutions

Part No. 54122-811401800LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 40 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    LV5254LG

Sanyo Semicon Device
Part No. LV5254LG
Description Bi-CMOS LSI Inverting Charge Pump Regulator IC
   Bi-CMOS LSI Inverting Charge Pump Regulator IC

File Size 135.46K  /  14 Page

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Amphenol Communications Solutions

Part No. 77311-401-03LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 03 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

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