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  0736 Datasheet PDF File

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    73656-5000 0736565000

Molex Electronics Ltd.
Part No. 73656-5000 0736565000
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Power Module, Vertical, SMC

File Size 391.44K  /  7 Page

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Amphenol Communications Solutions

Part No. 54121-107361150LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0736590003 73659-0003

Molex Electronics Ltd.
Part No. 0736590003 73659-0003
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Power Module, Vertical, SMC, Power Receptacle, 12 Circuits, Gold (Au) 0.76μm (30μ)

File Size 100.68K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-807361000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0736443007 73644-3007

Molex Electronics Ltd.
Part No. 0736443007 73644-3007
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position D, 144 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position D, 144 Circuits

File Size 174.33K  /  4 Page

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Amphenol Communications Solutions

Part No. 54121-107360950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0736443004 73644-3004

Molex Electronics Ltd.
Part No. 0736443004 73644-3004
Description 2.00mm (.079") Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location B
2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location B

File Size 174.33K  /  4 Page

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Amphenol Communications Solutions

Part No. 75160-107-36LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,36 position, 2.54mm pitch
Tech specs    

Official Product Page

    0736443003 73644-3003

Molex Electronics Ltd.
Part No. 0736443003 73644-3003
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position B, 144 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position B, 144 Circuits

File Size 164.13K  /  4 Page

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Amphenol Communications Solutions

Part No. 75168-107-36LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0736443001 73644-3001

Molex Electronics Ltd.
Part No. 0736443001 73644-3001
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position A, 144 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position A, 144 Circuits

File Size 174.87K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-107361150LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 36 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0736443000 73644-3000

Molex Electronics Ltd.
Part No. 0736443000 73644-3000
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position A, 144 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position A, 144 Circuits

File Size 164.67K  /  4 Page

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Amphenol Communications Solutions

Part No. 77315-807-36LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    0736441117

Molex Electronics Ltd.
Part No. 0736441117
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position N/A, 144 Circuits

File Size 167.84K  /  4 Page

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Amphenol Communications Solutions

Part No. 54121-107360800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0736441116

Molex Electronics Ltd.
Part No. 0736441116
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position N/A, 144 Circuits

File Size 167.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-807361150LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 36 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    73642-1000 0736421000

Molex Electronics Ltd.
Part No. 73642-1000 0736421000
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, Press-FitOpen End, 144 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, Press-FitOpen End, 144 Circuits

File Size 154.56K  /  4 Page

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Amphenol Communications Solutions

Part No. 54121-407360940LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

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