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  0032.1162 Datasheet PDF File

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    22-28-4320 A-42375-0032

Molex Electronics Ltd.
Part No. 22-28-4320 A-42375-0032
Description 2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, 32 Circuits, Tin (Sn) Plating, Mating Pin Length 6.09mm (.240)

File Size 522.38K  /  36 Page

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Rochester Electronics LLC

Part No. 100324/VYA
Description 100324 - TTL to ECL Translator, 6 Func, Complementary Output, ECL - Dual marked (5962-9153001VYA)
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    26-61-2150 41771-0032

Molex Electronics Ltd.
Part No. 26-61-2150 41771-0032
Description 3.96mm (.156) Pitch KK Solid Header, Vertical, without Peg, 15 Circuits, Gold (Au) Plating

File Size 237.33K  /  8 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. 2SA1162
Description PNP Bipolar Transistor / VCEO=-50 V / IC=-0.15 A / hFE=70~400 / VCE(sat)=-0.3 V / AEC-Q101 / SOT-346
Tech specs    

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    MSC1162 MSC1162A

OKI electronic componets
Part No. MSC1162 MSC1162A
Description 40-Bit Vacuum Fluorescent Display Tube Grid/Anode Driver

File Size 103.87K  /  14 Page

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Amphenol Communications Solutions

Part No. 79821-162HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 62 Positions, 2.54 mm Pitch, Vertical, 10.92 mm (0.43 in.) Mating, 5.08 mm (0.2 in.) Tail.
Tech specs    

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    SICK AG
Part No. VL180-2P41162
Description PHOTOELECTRIC SENSORS

File Size 2,934.18K  /  8 Page

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Amphenol Communications Solutions

Part No. 131-5116-21D
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

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    LPM11162

List of Unclassifed Manufacturers
Part No. LPM11162
Description Audio Module

File Size 227.17K  /  19 Page

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Amphenol Communications Solutions

Part No. 131-4116-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

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    SENSITRON SEMICONDUCTOR
Part No. D116218B
Description 15 A, SILICON, RECTIFIER DIODE

File Size 153.07K  /  3 Page

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Amphenol Communications Solutions

Part No. 77311-162-36LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    OKI
Part No. MSC1162A
Description 40-Bit Vacuum Fluorescent Display Tube Grid/Anode Driver
From old datasheet system

File Size 108.29K  /  14 Page

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Amphenol Communications Solutions

Part No. 10127721-162GLF
Description Minitek® Pwr 3.0, Dual Row, Vertical Through Hole Header, 16 Position, 3.2mm Kink Tail (Gold Flash) plating, GW Compatible LCP, Black Color,Tray Packing.
Tech specs    

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    SENSITRON SEMICONDUCTOR
Part No. D116212B
Description POWER SCHOTTKY RECTIFIER Very Low Voltage Drop

File Size 154.36K  /  3 Page

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Amphenol Communications Solutions

Part No. 75168-116-20LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Atmel
Part No. AT61162E
Description Radiation Hard 2Mbit x 8 SRAM Cube. Made of 16 stacked 128K x 8 SRAMs.

File Size 220.89K  /  14 Page

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Amphenol Communications Solutions

Part No. 54242-811162350LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Teledyne Technologies I...
Part No. IQM11621
Description    6.0 TO 10.8 GHz IQ MIXER MODULATOR/DEMODULATOR

File Size 230.75K  /  2 Page

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Amphenol Communications Solutions

Part No. 131-3116-21D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

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