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Kyocera, Corp. Advanced Analogic Technologies, Inc. KSS[Kyocera Kinseki Corpotation] American KSS
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| Part No. |
TCXO-204C2 VC-TCXO-204C2 VC-TCXO-204C2-16.8MHZ-OUT1-STBY1 VC-TCXO-204C2-14.4MHZ-OUT1-STBY1 VC-TCXO-204C2-12.8MHZ-OUT1-STBY2 VC-TCXO-204C2-19.2MHZ-OUT1-STBY1
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| Description |
TCXO, VC-TCXO 温补VC - TCXO tcvcxo, SINE OUTPUT, 19.2 MHz tcvcxo, SINE OUTPUT, 12.8 MHz tcvcxo, SINE OUTPUT, 14.4 MHz tcvcxo, SINE OUTPUT, 16.8 MHz TCXO/ VC-TCXO VC-TCXO for Personal Cellular Phone.
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| File Size |
127.04K /
1 Page |
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it Online |
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TOSHIBA
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| Part No. |
2SC2670
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| Description |
Transistor Silicon NPN Epitaxial Type (PCT process) high frequency Amplifier Applications AM high frequency Amplifier Applications AM frequency Converter Applications
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| File Size |
216.38K /
5 Page |
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it Online |
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Vectron International, Inc.
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| Part No. |
FX-102
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| Description |
frequency Translator55.52 MHz Output Locked to Input frequency 8kHz Clock,ultra Low Jitter PECL Output频率变换器(155.52MHz时钟输出kHz输入时钟,超低Jitter PECL
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| File Size |
576.05K /
7 Page |
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it Online |
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CREE POWER
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| Part No. |
W4NRD0X-0000 W4NRD8C-U000 W4NXD8C-0000 W4NXD8C-L000 W4NXD8D-0000 W4NXD8C-S000 W4NXD8D-S000 W4NXD8G-0000 W6NRE0X-0000 W6NRD0X-0000 W6PXD3O-0000 W6NXD3L-0000 W6NXD0K-0000 W6NXD3K-0000
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| Description |
Diameter: 50.8mm; LCW substrates; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition Diameter: 50.8mm; ultra-low mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition Diameter: 50.8mm; standatd mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition Diameter: 50.8mm; low mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition Diameter: 50.8mm; select mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition Diameter: 76.2mm; LCW type; 6H-silicon carbide. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition Diameter: 50.8mm; LCW type; 6H-silicon carbide. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition Diameter: 50.8mm; lsemi-insulating (prototype); 6H-silicon carbide. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
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| File Size |
273.34K /
17 Page |
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it Online |
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Price and Availability
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