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SGS Thomson Microelectronics
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| Part No. |
AN662
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| OCR Text |
...are more expensive. mosfets are often chosen for the power switch in soft-switching applications, due to their high speed and easy drive. however, for medium and high power applications, their high conduction losses begin to cause problems,... |
| Description |
IGBTS IN RESONANT CONVERTERS
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| File Size |
80.13K /
8 Page |
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Pickering
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| Part No. |
109P-1-A 109P-1-A-5/2D 109P-1-A-X
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| OCR Text |
... the small size of these relays often makes it possible to increase the functionality of existing designs without increasing the size of printed circuit boards. top (left to right): 109p, 109-1-a, 109-2-a bottom: 109-1-b, 10... |
| Description |
Micro SIL Reed Relays
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| File Size |
235.63K /
2 Page |
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it Online |
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SGS Thomson Microelectronics
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| Part No. |
AN524
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| OCR Text |
...ments of the application. it is often helpful to consider the gate as a simple capacitor when discussing drive circuits. 2. igbt / mosfet drive basics 2.1 gate vs base power mosfets and igbts are simply voltage driven switches, because thei... |
| Description |
DRIVE CIRCUITS FOR POWER MOSFETS AND IGBTS
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| File Size |
100.62K /
10 Page |
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SGS Thomson Microelectronics
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| Part No. |
AN253
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| OCR Text |
...le can be reduced by 40 db. but often the inductor is costly and bulky. often the degree of stability provided by the circuits described above is insufficient and a stabilizer circuit is needed. figure 12 shows the simplest solution and is ... |
| Description |
POWER SUPPLY DESIGN BASICS
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| File Size |
72.47K /
6 Page |
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SGS Thomson Microelectronics
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| Part No. |
AN1120
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| OCR Text |
...s made, and this information is often used to calculate rental or service charges or to investigate warranty claims. for example, if the number of copies recorded is significantly greater than the number of copies expected from a toner cart... |
| Description |
EEPROM-BASED APPLICATION SPECIFIC MEMORIES
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| File Size |
51.76K /
7 Page |
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http://
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| Part No. |
AN-9037
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| OCR Text |
...tion. using vias with 8x8 mlp often the designer will wish to place vias inside of the three thermal pads. while this is acceptable, the user should realize that vias often create voiding, and should carefully study the process desi... |
| Description |
8x8 MLP DriverMOS Packaging
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| File Size |
749.51K /
7 Page |
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it Online |
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http://
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| Part No. |
AN-9040
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| OCR Text |
...tion. using vias with power33 often the designer will wish to place vias inside of the drain pad. while this is acceptable, the user should realize that vias often create voiding, and should carefully study the process design with x-... |
| Description |
Power33 Packaging
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| File Size |
299.73K /
7 Page |
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it Online |
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http://
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| Part No. |
AN-9046
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| OCR Text |
...gn and a robust solder process often yields solder fillets to the ends of the lead due to the cleaning action of the flux in the solder paste. figure 2 : exposed copper on package edge, with solder wetting after reflow, from singulat... |
| Description |
Dual Power56 Packaging
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| File Size |
850.15K /
10 Page |
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it Online |
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