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Fairchild Semiconductor, Corp.
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| Part No. |
HCPL-0700
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| Description |
LOW INPUT CURRENT HIGH GAIN SPLIT DARLINGTON OPTOCOUPLERS 1 CHANNEL LOGIC OUTPUT OPTOCOUPLER
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| File Size |
272.72K /
11 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
77424-308LF
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| Description |
Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Through Hole, Dual Entry, Single Row, 8 Position ,2.54mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
73324-303LF
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| Description |
Dubox® 2.54mm, Wire to Board Connector, Shrouded Vertical Header, Press Fit, Single row, Top Entry, 3 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68602-430HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10124308-101LF
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| Description |
ExaMAX® 56Gb/s High Speed Backplane Connector 92Ohm, 3-Pair, 8 column, 88 position, Right Angle Receptacle, No Guide Pin.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68482-430HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 30 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77311-424-30LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Avago Technologies, Ltd.
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| Part No. |
HCPL-J314
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| Description |
0.4 Amp Output Current IGBT Gate Drive Optocoupler(0.4 放大输出电流 IGBT门驱动光耦合 0.4安培输出电流IGBT栅极驱动光电耦合器(0.4放大输出电流IGBT的门驱动光耦合器)
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| File Size |
235.66K /
16 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
54122-124243000LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Single Row, 24 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77313-124-30LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 30 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68002-430HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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DB Lectro, Inc.
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| Part No. |
HCPL-050L
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| Description |
LVTTL/LVCMOS Compatible 3.3 V Optocouplers (1 Mb/s)(203.23 k) LVTTL /的LVCMOS兼容3.3伏光耦(1 MB /秒)03.23十一
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| File Size |
205.40K /
10 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
48243-000LF
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| Description |
PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle.
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| Tech specs |
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Official Product Page
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Price and Availability
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| Part: HCPL-2430 |
| Maker: AGILENT |
| Pack: DIP-8 |
| Stock: 2253 |
| Unit price
for : |
|
50: $5.08 |
|
100: $4.83 |
| 1000:
$4.57 |
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